- Samsung’s investment coincides with improved relations between South Korea and Japan
- The semiconductor company initiated the strengthening of its advanced chip packaging division in the previous year
Samsung Electronics has recently announced its investment plan of around 40 billion yen ($280 million) over five years in a facility for research into advanced chip packaging, which will be set up in Japan.
A few months back, the company shared its plan to establish a packaging facility in Kanagawa prefecture. This place already has a research and development centre.
Japan’s industry ministry said it would subsidise Samsung worth up to 20 billion yen to support the revitalisation of domestic chip manufacturing.
Samsung’s investment coincides with improved relations between South Korea and Japan, as the United States urges its allies to collaborate in response to China’s expanding technological capabilities.
The semiconductor company initiated the strengthening of its advanced chip packaging division in the previous year. In a competitive landscape, businesses strive to advance packaging methodologies to enhance chip performance by integrating various components into a single package.
