- Semiconductor packaging is a process that connects chips with different functions
- Both companies will also announce a partnership on research and development
SKC has recently shared a plan to invest in U.S. semiconductor packaging startup Chipletz
The amount hasn’t been disclosed yet. By making this investment, SKC will be able to expand its semiconductor processing business.
Launched in 2016, Chipletz is an internal venture company of global semiconductor giant AMD and was spun off in 2021. The company has been recognised by experts for its capabilities in designing advanced semiconductor substrate architecture, technology development, and networking with large customers.
AMD and Taiwan’s ASE, the world’s No. 1 semiconductor rear-end processing outsourcing company, already invested in Chiplet and are shareholders.
Semiconductor packaging is a kind of process that connects chips with different functions organically. It is emerging as a major factor in determining the power of a chipset.
This investment will be quite helpful for SKC’s semiconductor packaging. Both companies will also announce a partnership on research and development and responding to the U.S. CHIPS Act.
