Soitec announces industry’s 1st four-junction solar cell for concentrator photovoltaic systems

Saturday, May 25, 2013: Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, announced today the industry’s first four-junction solar cell device, which works under concentrated sunlight, putting the company on the solar-energy industry’s technology roadmap at a world-class level of an outstanding 43.6 percent efficiency. This technology development – made possible through strong collaboration between solar cell device and epitaxial growth centers of expertise combined with Soitec’s decades-long leadership in substrate-bonding and layer-transfer technologies – validates the unique roadmap enabling, thanks to the four junctions structure to target the 50-percent efficiency level. This roadmap marks a major competitiveness breakthrough in the photovoltaic industry.

Soitec’s four-junction solar cell has achieved today a peak efficiency of 43.6 percent, as confirmed by the Fraunhofer ISE Calibration Laboratory. This measurement was achieved at a concentration level of 319 (319 suns). The new cell has demonstrated more than 43 percent energy-generating efficiency over a concentration range between 250 and 500.

Today’s triple-junction solar cells used in commercial concentrator photovoltaic (CPV) modules in real-world applications are approaching their physical limits in converting sunlight into renewable energy. Soitec’s four- junction cell is designed to increase the conversion efficiency of commercial CPV systems to the highest level ever achieved by any photovoltaic technology. Based on the initial results obtained using very few integration runs, Soitec is well positioned at the front of the efficiency race.

The innovative four-junction cell uses two new, highly sophisticated dual-junction sub cells grown on different III-V compound materials, which allows optimal band-gap combinations tailored to capture a broader range of the solar spectrum. This maximizes energy-generating efficiency. Soitec leverages its proprietary semiconductor-bonding (Smart Stacking™) and layer-transfer (Smart Cut™) technologies, which have been used in volume production by the global semiconductor industry for decades, to successfully stack non-lattice-matched materials while also raising the possibility of re-using expensive materials.

The new cell was developed in collaboration with the Fraunhofer Institute for Solar Energy Systems (ISE) in Freiburg, Germany, and the Helmholtz-Zentrum für Materialien und Energie in Berlin, which developed and deposited III-V epitaxial layers on new base materials as well as fabricating and characterizing the device. CEA-Leti, France’s research institute for electronics and information technologies, also actively participated in the project and contributed its expertise in mechanically strong, electrically conductive and optically transparent bonding interfaces as well as layer-transfer engineering of III-V compound materials.

- Advertisement -

“Boosting efficiency levels is a key step in outperforming the economics of conventional PV. This great achievement brings strong value to our solar division and validates our strategy and business model in the solar market,” said André-Jacques Auberton-Hervé, CEO of Soitec. “Through our collaboration with the Fraunhofer and the Leti, two world-class R&D partners, our own leadership experience in materials and bonding technologies as well as our CPV commercial experience, we have been able to achieve this major advancement in a very short time. This represents a major proof-of-concept, on track to demonstrate a concentrated solar cell with 50% efficiency as soon as 2015.”

- Advertisement -
Loading form…

Industry's Buzz

Potential US Curbs Bears Down on Chinese Optical Chip Stocks

0
Shares of upstream laser chip suppliers suffered steeper declines compared to downstream optical transceiver manufacturers. A report by Morgan Stanley, earlier this month, warned...
Prime Minister Modi

Modi Flags 6G And Domestic Electronics Production At IMC 2026

0
Prime Minister Narendra Modi has outlined India's next telecom priorities at India Mobile Congress 2026, linking the 5G-to-6G roadmap with semiconductor production, domestic electronics...
Fujitsu

Fujitsu-Owned 1Finity Deploys 200+ Engineers To Expand India’s Optical Networking Business

0
Japan’s Fujitsu-owned 1Finity is expanding its India networking business with more than 200 engineers as AI and data-centre growth drives demand for optical networking...
Mivi factory

Mivi Targets Indigenous Smartphone Design With In-House Electronics Engineering

0
Indian consumer electronics brand Mivi aims to develop an indigenously designed smartphone within 12 months by building in-house circuit design, PCB and software engineering...
GlobalFoundries logo

GlobalFoundries and TSMC Partner on US Interposer Production for CoWoS

0
Five-year agreement expands Malta, New York fab to create domestic supply chain for high-performance AI chips. GlobalFoundries (GF) has reached an agreement with TSMC to...

Learn From Leaders

Does India’s Chip Packaging Growth Need Local Materials At Scale?

0
What will it take for specialised semiconductor materials manufacturing to grow in India? Packaging volumes will be a key factor as OSAT facilities move...
Ronak Kumar Samantray, Founder, TM2Space Technologies Pvt Ltd.

“Our goal is to build data centres in space.” – Ronak Kumar Samantray, TM2Space

0
A space startup aims to build orbital data centres, letting users run AI models and store data on satellites while also supplying satellite hardware...

India’s Photonics Puzzle Is Finally Coming Together 

0
Can India turn its scattered photonics capabilities into a stronger industry? A new association aims to connect the ecosystem and strengthen the domestic value...
Jin Bains, CEO, Mini-Circuits

Mini-Circuits CEO Jin Bains on Navigating High-Frequency Component SWaP-C Constraints, Emerging Markets, and Career...

0
In this exclusive, Jin Bains, Chief Executive Officer (CEO) of Mini-Circuits, explains in a conversation with Dilin Anand of EFY about areas of emerging...

India Needs Not a Hundred, But Thousands of Chip Diversified Companies 

0
Can India build a semiconductor ecosystem beyond fabs? Indiesemic believes thousands of diversified chip companies are needed to make that possible. India’s semiconductor push is...

Startups

PowerMon

Aquaexchange Brings Monitoring And Automation To Shrimp Farming

0
The startup has developed an AI- and IoT-enabled platform that helps shrimp farmers manage farms, access financing, monitor operations, and connect with markets. The startup...

Drone-Like Aircraft For Logistics From BluJ Aerospace

0
Hyderabad-based BluJ Aerospace is developing indigenous electric and hydrogen-powered vertical take-off and landing (VTOL) aircraft for remote cargo transport. BluJ Aerospace, a Hyderabad-based aerospace startup...
Jash Jetly, Co-founder and CEO of EVE

“The cloud isn’t the only way to run AI. We’re proving it can happen...

0
A startup is building a decentralised AI and communication network that runs across everyday devices instead of centralised cloud servers. In an interview, Jash...
Mohit Gupta, founder and CEO, TYLsemi

Building AI Chips, One Block at a Time 

0
What if building an AI chip became as simple as assembling reusable blocks? The startup is working to make custom silicon accessible beyond the...
Seema Johar, Co-Founder and Product Director, Compcarta Solutions Pvt Ltd

“We Let Designers Focus on Innovation, Not Infrastructure.”- Seema Johar, Compcarta Solutions

0
In an exclusive interview, Seema Johar of Compcarta speaks with EFY’s Akanksha Sondhi Gaur about why setting up an EDA environment can be harder...