Signing a deal with Kaynes Semicon and Perceptives Solutions to enhance semiconductor R&D, Tamil Nadu-based Sastra University aims to establish a training academy and prototype line for chip packaging.
Sastra, a private deemed university in Thanjavur, Tamil Nadu, has signed a memorandum of understanding (MoU) with Mysuru-based Kaynes Semicon and IT firm Perceptives Solutions to enhance capacity in the semiconductor R&D. Signed on Saturday, this agreement includes plans to establish a research and development centre focused on chip packaging.
It has been further disclosed that the collaboration will lead to the creation of the ‘Kaynes-Perceptives-Sastra Packaging Training Academy’ and ‘QFN Prototype Line’, including a clean room facility. However, no financial information about this deal was announced.
Emphasising the importance of developing human resources for India’s semiconductor manufacturing success, Raghu Panicker, CEO of Kaynes Semicon, highlighted the importance of this MoU at the graduation ceremony of Sastra.
He further stated that the global semiconductor packaging market is proliferating, projected to increase from $47.22 billion in 2024 to $79.37 billion by 2029, with a compound annual growth rate (CAGR) of 10.95%.
Owing to this growth, India’s share in this industry is expected to rise as more advanced packaging facilities are established domestically. Panicker asked the graduates to stay informed about developments in semiconductor technology.
K. Bhanupriya, Managing Director of Perceptives Solutions, pointed out that trained professionals in semiconductor packaging are essential for leveraging India’s demographic dividend across various sectors, including consumer goods, automotive, and high-power computing.
At the same time, Dr S. Vaidhyasubramaniam, Vice-Chancellor of Sastra, expressed the university’s commitment to supporting the academy’s development and recalled successful collaborations with Tata Electronics, Delta Electronics, Global Foundries, and Taiwanese universities to strengthen the semiconductor value chain.
