FC-BGA substrates are used in high-density semiconductor packages
TOPPAN Inc. has established its first overseas production facility for Flip Chip Ball Grid Array (FC-BGA) substrates in Singapore to meet rising demand from artificial intelligence (AI), data centres, and networking applications.
The new production site has been established at ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD. (AST), a TOPPAN Group company in Singapore. The facility was inaugurated on September 29, with support from the Singapore Economic Development Board (EDB) and semiconductor company Broadcom.
FC-BGA substrates are used in high-density semiconductor packages and are increasingly required for AI and networking equipment as data traffic and computing workloads continue to grow.
The new facility will focus on producing large-size, high-layer-count FC-BGA substrates and will complement production at its Niigata Plant in Japan. The company said the expansion is also aimed at strengthening its business continuity planning by diversifying production locations to mitigate risks arising from natural disasters and geopolitical disruptions.
Satoshi Oya, Representative Director, President and COO, TOPPAN Holdings, said Singapore was selected as a strategic global hub due to its business environment, location, and forward-looking approach.
“Through a strong partnership with BROADCOM, TOPPAN and AST will deliver innovative technologies from Singapore to the global market,” Oya said.
Production at the Singapore facility is scheduled to begin in 2026. TOPPAN aims to increase the production capacity of its FC-BGA substrate business to at least 2.5 times its fiscal 2022 level by the end of fiscal 2027.
The expansion will support the growing demand for semiconductor package substrates and contribute to the development of global digital infrastructure.
