- TSMC has scheduled a formal opening ceremony on February 24
- There are speculations that TSMC may construct another fab in Japan
TSMC’s first fab in Japan will open on February 24, 2024. This facility will be able to make chips using TSMC’s N28 (28nm-class) technologies — and will be the most advanced logic fab in Japan.
The semiconductor manufacturing facility is poised to handle wafer processing using various production nodes stemming from the company’s N28 (28nm-class) technology. This encompasses multiple N28 variations and the 22ULP fabrication process, tailored for ultra-low-power applications.
Although these manufacturing technologies are deemed outdated for advanced system-on-chips (SoCs) for smartphones, PCs, or high-performance CPUs/GPUs, they are well-suited for components employed in the automotive and consumer electronics sectors. In Japan, there remains substantial demand for such processors due to the presence of numerous sizable companies in these sectors.
These technologies are anticipated to maintain relevance for an extended period. TSMC has scheduled a formal opening ceremony on February 24, with chip production at the facility commencing as planned in the second half of 2024.
There are speculations that TSMC may construct another fab in Japan, capable of processing wafers using TSMC’s N16-derived process technologies, encompassing N16, N12, and N12e, falling within the 16nm and 12nm classes.
