Powering the AI revolution from Singapore, Nearfield Instruments and A*STAR IME unite to develop breakthrough semiconductor metrology tech for next-gen chips and advanced packaging.
Nearfield Instruments has entered a multi-year collaboration with Singapore’s A*STAR Institute of Microelectronics (IME) to develop cutting-edge semiconductor metrology solutions for the AI and advanced packaging era.
The partnership aims to push the boundaries of metrology required for advanced chips, as the global demand for artificial intelligence grows.
The companies highlighted that as chip designs become more complex, the need for high-precision measurement and process control is more critical than ever.
“AI is reshaping every industry, but it relies heavily on how efficiently we can manufacture the underlying chips,” said Hamed Sadeghian, CEO of Nearfield Instruments. “Our work with A*STAR IME will focus on hybrid bonding and heterogeneous integration—key to making AI chips faster, smaller, and more energy-efficient.”
The move comes as semiconductor manufacturers shift away from traditional scaling methods toward new packaging technologies. These allow various chiplets to be integrated into a single unit, increasing performance while reducing power consumption.
However, this innovation brings manufacturing challenges that require advanced metrology to maintain quality and yield. The companies did not disclose the financial information of the partnership.
Singapore’s Economic Development Board (EDB) welcomed the announcement. “This partnership is a testament to Singapore’s growing role in semiconductor R&D,” said Chang Chin Nam, Senior Vice President and Head of Semiconductors at the EDB. “We are pleased to support global companies like Nearfield as they invest in our innovation ecosystem.”
The partnership also marks Nearfield’s continued expansion into Southeast Asia.
