The semiconductor equipment maker reported a surge in bookings as next-generation AI processors accelerate adoption of advanced chip stacking technologies.
BE Semiconductor Industries (BESI) reported a sharp rise in new orders for the latest quarter, driven by expanding demand across its end markets and strong momentum in hybrid bonding technology used in advanced chip packaging.
The Dutch semiconductor equipment maker said first-quarter order bookings a key indicator of future revenue surged 104.5% year-on-year to €269.7 million ($315.5 million), up from €131.9 million in the same period last year.
Investor optimism around BESI has largely centred on its early leadership in hybrid bonding solutions, a technology that enables chips to be stacked directly on top of each other to improve performance and efficiency. The technology is increasingly viewed as critical for next-generation artificial intelligence processors.
Chief Executive Richard Blickman said favourable order trends during the quarter highlight BESI’s strong positioning in advanced packaging technologies supporting emerging AI applications.
While demand remains subdued in segments such as automotive electronics, PCs and memory chips, robust spending tied to AI infrastructure continues to offset broader semiconductor market weakness.
Recent earnings updates from major industry players including Taiwan Semiconductor Manufacturing Company (TSMC), ASML and ASM International also point to sustained momentum in AI-related semiconductor investments.
Looking ahead, BESI expects second-quarter revenue to grow between 30% and 40% sequentially, compared with €184.9 million recorded in the first quarter of 2026.
($1 = €0.8548)
