Could smarter semiconductors transform Europe’s energy future? A €91 million project unites 62 partners to develop advanced power electronics for industry and mobility.
Infineon Technologies AG has launched Moore4Power, a €91 million European research and development (R&D) initiative aimed at advancing power electronics technologies for renewable energy, electric mobility and industrial applications.
The three-year project, supported through the European Union’s Chips Joint Undertaking and national funding programmes, brings together 62 organisations from 15 countries, including large corporations, small and medium-sized enterprises, universities and research institutes.
According to Infineon, the programme seeks to address the limitations of traditional semiconductor scaling by focusing on system-level integration rather than simply reducing transistor size.
The project adopts a “More than Moore” approach, combining multiple semiconductor technologies and functions within integrated systems to improve efficiency, reliability and performance.
A key area of development will be heterogeneous integration, which combines silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) technologies with sensing, control, and communication capabilities. The project will also build on power chiplet architectures to create modular and scalable power electronic systems suitable for a range of applications.
Infineon said the initiative builds on research carried out under the PowerizeD project, which concluded in 2025 and focused on improving efficiency and reliability in power electronics.
The consortium aims to develop technologies for sectors where power conversion plays a significant role in energy consumption and operating costs. Planned applications include wind energy systems, electric vehicle charging infrastructure and railway propulsion systems.
Project participants estimate that future technologies could support charging efficiencies of up to 99% in e-mobility applications and reduce propulsion losses in rail systems by at least 30%.
Another focus of Moore4Power will be the use of artificial intelligence, digital twins and automated engineering workflows to shorten development cycles. The project aims to reduce the time required to move from initial fabrication samples to validated product specifications from several weeks to approximately one week.
The initiative also plans to incorporate Digital Product Passports into power modules. These wireless-accessible records will provide lifecycle information, including operating conditions, product health and remaining service life, supporting maintenance planning, reuse and recycling.
The consortium includes organisations from Austria, Belgium, Czechia, Finland, France, Germany, Greece, Hungary, Italy, Latvia, the Netherlands, Romania, Spain, Sweden and Switzerland, reflecting a broad European effort to strengthen capabilities in advanced semiconductor technologies.
