Cadence and Samsung Foundry have expanded their partnership to deliver advanced IP, AI-driven design tools, and 3D-IC capabilities for next-generation 2nm AI and high-performance computing chips.
Cadence and Samsung Foundry have strengthened their collaboration to support the development of next-generation AI, high-performance computing (HPC), and advanced semiconductor designs on Samsung’s second-generation 2nm process technology.
The expanded partnership combines Cadence’s design software, AI-driven electronic design automation (EDA) tools, and a broader portfolio of memory and interface IP to help customers accelerate chip development while improving performance, power efficiency, and time-to-market. The agreement builds on previous work between the two companies, which had already certified Cadence tools and IP for several Samsung manufacturing nodes.
Under the new collaboration, Cadence will provide advanced interface technologies, including NVIDIA NVLink-C2C-enabled connectivity, high-speed SerDes, PCIe, UCIe, and leading memory interfaces optimized for Samsung’s 2nm platform. These technologies are designed to support increasingly demanding AI infrastructure, data center, and edge computing applications.
The companies have also expanded support for advanced 3D-IC design and packaging technologies. Cadence’s design suite, including Innovus, Virtuoso, Integrity 3D-IC, Voltus, Quantus, and Tempus, has been certified for Samsung’s second-generation 2nm process. The tools enable chip designers to handle growing design complexity while achieving better performance, power, and area optimization.
A key focus of the partnership is Samsung’s 3D Cube-H technology, which uses hybrid copper bonding to improve chip integration. The joint design flow provides planning, implementation, verification, and signoff capabilities for advanced 3D semiconductor architectures.
The ecosystem collaboration also includes NVIDIA, which is leveraging the platform for next-generation AI systems and high-bandwidth interconnect technologies, and Ambarella, which is developing 2nm edge AI processors for robotics, drones, autonomous machines, and intelligent sensing applications.
Cadence and Samsung Foundry plan to showcase the latest results of their partnership at the Samsung Advanced Foundry Ecosystem (SAFE) 2026 event, highlighting AI-optimized 2nm and 3D-IC design flows for future semiconductor innovation.
