The collaboration is expected to expand the availability of A-PHY-based connectivity across mainstream automotive camera applications
Valens Semiconductor and onsemi have announced a collaboration to develop a cost-optimised integrated sensor solution for high-volume 3-megapixel automotive camera applications, aimed at accelerating the adoption of MIPI A-PHY among automotive OEMs and Tier 1 suppliers.
Under the collaboration, Valens will work with onsemi to develop an A-PHY offering that can be integrated into onsemi’s image sensors. The companies said the collaboration combines their expertise in automotive connectivity and imaging technologies while strengthening the A-PHY ecosystem.
The solution is intended to address the 1–3MP range, which the companies said represents the majority of automotive image-sensor applications. As automakers move toward higher-resolution camera systems, the 3MP segment offers an entry point for A-PHY adoption in high-volume vehicles.
“ The integrated, cost-optimised 3MP offering complements Valens’ existing solutions, bringing A-PHY to a much broader range of use cases,” said Yoram Salinger, CEO, Valens Semiconductor. He added that working with onsemi, another supplier of A-PHY silicon, would strengthen the ecosystem and provide automakers with greater supplier choice.
Ahmed Salem, Vice President and General Manager, Intelligent Sensing Group, onsemi, said automotive customers are seeking solutions that simplify system design while maintaining performance as imaging systems become more sophisticated.
According to the companies, the integrated approach could help reduce component count, support industry standards, and simplify the deployment of advanced automotive vision systems.
The collaboration is expected to expand the availability of A-PHY-based connectivity across mainstream automotive camera applications, particularly as OEMs increase the number and resolution of cameras deployed in vehicles.
