Nexstrom has secured $12 million to commercialise 300mm 2D semiconductor wafers, targeting the manufacturing bottleneck standing between advanced 2D materials and AI chips.
Nexstrom has raised $12 million in seed funding to commercialise its wafer-scale 2D semiconductor platform for AI and high-performance computing (HPC) chips. The round was led by Xora Innovation, with participation from Foothill Ventures and SEEDS, taking the Singapore-based company’s total capital raised to $15 million, including $3 million in non-dilutive funding.
The company plans to accelerate development of what it describes as the industry’s first 12-inch (300mm) single-crystal 2D semiconductor platform built around production-ready manufacturing tools. Nexstrom is also working with semiconductor industry partners to validate the technology within existing chip-manufacturing workflows.
Its platform targets a key semiconductor manufacturing challenge: producing 2D materials uniformly and repeatedly across the large wafers required by commercial fabs. Nexstrom combines proprietary chemical vapour deposition hardware, specialised process technology and wafer-scale 2D material growth, with the technology designed to integrate directly into existing foundry workflows.
The company is developing atomically thin 2D materials as a potential alternative to conventional silicon transistor materials, as continued silicon scaling faces increasing physical and energy-efficiency constraints. The technology is aimed at AI accelerators, data centres and other HPC applications.
“The question is no longer whether 2D semiconductors matter. They are already on the technology roadmap of major semiconductor companies. The challenge is making them manufacturable,” said Dr. Philip Wong, Board Advisor at Nexstrom and Inez Kerr Bell Professor at Stanford University.
Founded in 2024, Nexstrom will use the funding for platform development, foundry collaborations and expansion of its engineering and leadership teams.
