Netlist Seeks US Import Ban on Micron Memory Chips Used by Nvidia and Google

Patent-licensing firm files ITC complaint alleging high-bandwidth memory infringement across major AI server hardware.

Computer memory firm Netlist has filed a complaint with the US International Trade Commission (ITC) seeking to block imports of Micron dynamic random access memory (DRAM) products and downstream hardware from Google, Nvidia, and Broadcom. Netlist claims that Micron’s memory chips and the processing units, servers, and hardware incorporating them infringe two of its patents covering high-bandwidth memory (HBM) architectures vital for artificial intelligence workloads.

The legal challenge follows previous patent victories for Netlist in Texas federal court, where it secured a $445 million infringement verdict against Micron in 2024, alongside a separate $421 million verdict against Samsung Electronics that was settled in August. Netlist previously initiated another ITC action against Micron in August targeting chips integrated into products from Super Micro Computer, Hewlett Packard Enterprise, and Lenovo. Representatives for Micron, Google, Nvidia, and Broadcom did not immediately comment on the filing.

C.K. Hong, Chief Executive Officer at Netlist, said: “Netlist has spent decades developing advanced memory technologies now used in rapidly expanding AI infrastructure. This action reflects our continued commitment to protecting our foundational technologies from unauthorized use.”

- Advertisement -
Loading form…
Jaydeep Gadhavi
Jaydeep Gadhavi
Jaydeep Gadhavi is a journalist with EFY business focusing on EV as well as Semiconductor business news.

Industry's Buzz

Lam Research Opens 470000-Sq-Ft Logistics Hub to Bolster US Chip Supply Chain

0
Centralised California facility leverages robotic automation to support global AI chip equipment demand and accelerate logistics. Semiconductor equipment manufacturer Lam Research has opened a 470,000-square-foot...
GlobalFoundries logo

MIPS and Xcelsa Labs Partner to Accelerate Custom Silicon Development

0
Strategic collaboration integrates verified intelligence platforms to cut design iteration cycles for AI, automotive, and robotics hardware. MIPS, a subsidiary of GlobalFoundries, has announced a...

Global Electronics Association and Fraunhofer Partner on EU Chips Act Pilot Line

0
Strategic collaboration aims to standardise advanced packaging and chiplet integration to bridge the gap between pilot-line innovation and mass production. The Global Electronics Association has...

Pulsiv Signs Manufacturing Deal for High-Power USB-C Modules

0
Pulsiv has developed its modules using its patented OSMIUM AC-DC conversion technology UK-based power electronics company Pulsiv has signed an exclusive manufacturing and supply agreement...

TOPPAN Opens First Overseas FC-BGA Substrate Plant in Singapore

0
FC-BGA substrates are used in high-density semiconductor packages TOPPAN Inc. has established its first overseas production facility for Flip Chip Ball Grid Array (FC-BGA) substrates...

Learn From Leaders

Does India’s Chip Packaging Growth Need Local Materials At Scale?

0
What will it take for specialised semiconductor materials manufacturing to grow in India? Packaging volumes will be a key factor as OSAT facilities move...
Ronak Kumar Samantray, Founder, TM2Space Technologies Pvt Ltd.

“Our goal is to build data centres in space.” – Ronak Kumar Samantray, TM2Space

0
A space startup aims to build orbital data centres, letting users run AI models and store data on satellites while also supplying satellite hardware...

India’s Photonics Puzzle Is Finally Coming Together 

0
Can India turn its scattered photonics capabilities into a stronger industry? A new association aims to connect the ecosystem and strengthen the domestic value...
Jin Bains, CEO, Mini-Circuits

Mini-Circuits CEO Jin Bains on Navigating High-Frequency Component SWaP-C Constraints, Emerging Markets, and Career...

0
In this exclusive, Jin Bains, Chief Executive Officer (CEO) of Mini-Circuits, explains in a conversation with Dilin Anand of EFY about areas of emerging...

India Needs Not a Hundred, But Thousands of Chip Diversified Companies 

0
Can India build a semiconductor ecosystem beyond fabs? Indiesemic believes thousands of diversified chip companies are needed to make that possible. India’s semiconductor push is...

Startups

Jash Jetly, Co-founder and CEO of EVE

“The cloud isn’t the only way to run AI. We’re proving it can happen...

0
A startup is building a decentralised AI and communication network that runs across everyday devices instead of centralised cloud servers. In an interview, Jash...
Mohit Gupta, founder and CEO, TYLsemi

Building AI Chips, One Block at a Time 

0
What if building an AI chip became as simple as assembling reusable blocks? The startup is working to make custom silicon accessible beyond the...
Seema Johar, Co-Founder and Product Director, Compcarta Solutions Pvt Ltd

“We Let Designers Focus on Innovation, Not Infrastructure.”- Seema Johar, Compcarta Solutions

0
In an exclusive interview, Seema Johar of Compcarta speaks with EFY’s Akanksha Sondhi Gaur about why setting up an EDA environment can be harder...

Space Solar Secures $1.7m ARIA Contract for Wireless Power Beaming

0
Harwell-based firm to develop ground-to-air RF beaming technology for persistent high-altitude platforms. Harwell-based wireless power specialist Space Solar has secured a $1.7 million (£1.3 million)...
Mohit Gupta, Founder and CEO, TYLsemi

“We are democratising custom silicon with reusable chiplets, enabling more companies to build their...

0
In an exclusive interview,Mohit Gupta from TYLsemi explains to Saba Aafreen from Electronics For You as to why the future of AI infrastructure will...