Can India turn semiconductor approvals into production quickly? CDIL is scaling packaging capacity with three new OSAT lines.
Continental Device India Limited (CDIL) is expanding its semiconductor packaging capacity with three production lines, with the first line set up within 10 months of receiving approval under India’s semiconductor programme. In an exclusive interaction with EFY, Pankaj Gulati, President of CDIL, said the second and third lines are expected to be operational within the next 18 months.
The company has focused on semiconductor assembly and testing after closing its wafer fabrication operations in 2008–09. It is now targeting higher production volumes through both its OSAT business and its own semiconductor brand, with production planned for Indian and international markets.
The company runs its manufacturing flow in-house at its Mohali plant, covering dicing, die bonding, encapsulation, testing, and packing.
What will it take for India’s growing semiconductor packaging capacity to build a deeper domestic supply chain? How quickly can materials, equipment, and talent catch up? In a longer interaction, Gulati also discusses CDIL’s OSAT expansion, talent challenges, and the need for more products designed in India.
