FCI enrols with high density packaging user group

Saturday, April 05, 2014: FCI, a leading supplier of connectors and interconnect systems, announces its enrolment with the HDP User Group (High Density Packaging User Group International Inc.). HDP User Group is a non-profit trade organization offering memberships to companies in the supply chain business of manufacturing products that utilize high-density electronic packages.

The foundation of HDP User Group lies with its multi-company cooperation on technical issues of common concern to its members, such as characterization of new packaging concepts with respect to reliability and technical performances. Members contribute resources needed for running these projects and share results. This achieves high degrees of leverage, and accomplishes much more with much less from each member.

FCI is participating in HDP User Group’s Optical and Press-fit project collaborations, although the firm may explore the group’s other endeavors such as the Process Sensitivity project or PWB technology projects in the future. Companies are encouraged to work together to accomplish HDP User Group’s mission in these group efforts. Projects are typically proposed by three or more member companies, and have to be approved by the Board.

“As a member of HDP User Group, our objective is to have a better understanding of future customer application needs, and to work along with other member companies to develop new interconnection packaging solutions so as to advance technologies aligned with the interconnect industry roadmap,” says Danny Morlion, Chief Technology Officer for FCI Electronics.

Benefits for participating companies include the opportunity to work with other affiliates in the same industry, as well as the expansive reach and exposure to advanced technologies involved in these projects. In return, FCI also intends to contribute to the electronic supply chain sectors with its presence and active participation.

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