The SEMI Power & Compound Fab Report to 2024 had earlier revealed that 63 companies are expected to add more than 2 million WPM (in 200mm equivalents) from 2021 through 2024
Global semiconductor equipment billings increased a robust 38% year-over-year to US$26.8 billion in the third quarter of 2021, an 8% rise from the prior quarter to register their fifth consecutive quarter-over-quarter record high, SEMI announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
“Strong secular demand for chips across a wide range of markets including communications, computing, healthcare, online services and automotive has fueled this tremendous run of record quarterly growth for semiconductor equipment,” said Ajit Manocha, SEMI president and CEO.
He added, “The semiconductor industry has demonstrated great resiliency in the face of disruptive global challenges including the chip shortage and ongoing pandemic.”
The SEMI Power & Compound Fab Report to 2024 had earlier revealed that 63 companies are expected to add more than 2 million WPM (in 200mm equivalents) from 2021 through 2024. Infineon, Hua Hong Semiconductor, STMicroelectronics and Silan Microelectronics will lead the way, together adding a projected 700,000 WPM.
The industry is also adding production facilities. From 2021 through 2024, 47 high-probability facilities and lines (R&D to high volume, including epitaxial wafers) are expected to go online to bring the industry total to 755, a number that could be eclipsed if new facilities and lines are announced.
