STMicroelectronics To Manufacture SiC Substrate In Italy

ST believes that it will support the increasing demand for SiC devices across automotive and industrial applications

A leading global semiconductor maker, STMicroelectronics recently announced that it will open an integrated Silicon Carbide (SiC) substrate manufacturing facility in Italy. The company is developing the facility at ST’s Catania site, where production is expected to begin next year.

The official statement termed it a key step in advancing ST’s vertical integration strategy for its SiC business. ST believes that it will support the increasing demand from ST’s customers for SiC devices across automotive and industrial applications as they transition to electrification and seek higher efficiency.

STMicroelectronics’ President and CEO, Jean-Marc Chery stated: “ST is transforming its global manufacturing operations, with additional capacity in 300mm manufacturing and a strong focus on wide bandgap semiconductors to support its $20+B revenue ambition. We are expanding our operations in Catania, the centre of our power semiconductor expertise and where we already have integrated research, development and manufacturing of SiC with strong collaboration with Italian research entities, universities and suppliers. This new facility will be key to our vertical integration in SiC, reinforcing our SiC substrate supply as we further ramp up volumes to support our automotive and industrial customers in their shift to electrification and higher efficiency.”

The company said that the SiC substrate manufacturing facility will be a first of a kind in Europe for the production of 150mm SiC epitaxial substrates, integrating all steps in the production flow. It must be noted that in the framework of the National Recovery and Resilience Plan, the State of Italy will financially support the investment of €730 million over five years.

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Committed to becoming carbon neutral by 2027, STMicroelectronics is a leading semiconductor and integrated device manufacturer. ST claims to enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and connectivity.


 

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