Monday, March 10, 2014: The heart of the SMT assembly process, a pick and place machine, is an expensive piece of equipment. Buyers need to plan very carefully prior to making a purchase, as there is a wide choice available.However, not too many companies make high-volume pick and place machines. Hence, only a few machines were launched in 2013, despite the presence of major companies in the global market.
Model: M20, Brand: I-Pulse, Manufacturer: Yamaha Motor Co Ltd, Japan
Upgraded in January 2014, the M20 is a true multi-mounter pick and place machine, which can place any type and size of SMD and odd-sized through-hole component, dispense solder paste and glue, apply flux and place bare die components from the waffle tray. It can do component inspection after placement and can handle long LED boards of up to 1800×600 mm.
Key features
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Rated speed of up to 30,000 CPH with 25 micron accuracy
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PCB handling size of up to 1480 x 510 mm STD and up to 1800×600 mm (optional)
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Component sizes from 01005 up to 120×90 mm with component heights of up to 30 mm
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Can handle a feeder capacity of up to 146 with feeder types like tape, tray, stick, waffle, bowl and label feeders
Contact details: Suguru Yasutomi, Ph: +81-53-484-1876, yasutomis@yamaha-motor.co.jp, www.yamaha-motor.co.jp/smt/ipulse/
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Model: NXT-III, Brand: Fuji, Manufacturer: Fuji Machine Manufacturing Company, Japan
Launched in September 2013, the NXT-platform benchmarks the concept of flexibility, modularity and scalability. The machine is designed to perform and deliver a highly accurate output, efficiently and reliably. With the wide success of the NXT platform, Fuji has launched its next generation of placement machines—NXT-III. The NXT-III comes with the latest H24 placement head, a capacity of 35,000 CPH and an industry-leading accuracy of 25 micron at 3 Sigma. NXT-III is capable of handling chip components with package of 03015 (in mm) and has a newer user-friendly GUI with a touchscreen.
Key features
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High speed placement head H24 for 35,000 CPH
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PCB sizes of up to 534×610 mm
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Exchangeable placement head
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Component handling capacity from 03015, 0402(01005) to 74j74 mm and height of up to 25.4 mm
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Placement accuracy of 25 micron at 3 Sigma
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Component handling capability in tape/reel, stick, tray
Contact details: T Shimizu, managing director, Ph: +65-6746-4966, shimizu.t@fuji-smt.com.sg, www.fuji.co.jp/
India distributor: NMTronics India Pvt Ltd
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Model: ONYX 21, Brand: ZEVAC, Manufacturer: ZEVAC AG, Switzerland
Launched in October 2013, ONYX 21 has been designed according to application requirements in a compact machine design that doesn’t compromise on the functionality. It offers force measurement, strong top and bottom heating, nitrogen connection and modularity as standard features. The pre-heater 300×300 mm offers powerful 3500 W for bottom heating and 2000 W for top heating. It is suitable for higher temperatures and exact temperature profiling for lead-free applications. The Z-axis is motorised and places the component automatically with force in the gramme range onto the board to protect sensitive components. With the optional board cooling feature, the cycle time can be reduced to a minimum, and the temperature profile does meet the requirements even of sophisticated applications.
Key features
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Motorised vision and Z-axis, closed loop motion control
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Compact, stable design for smaller boards, but also capable of handling boards up to 300 mm×400 mm
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Strong top and bottom heating: 2000 W top side heater; 3500 W 300×300 mm bottom side preheating
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The board cooling option aids lead-free soldering and faster process times
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External site solder cleaning system: This optional feature helps in redressing the site after the component is removed
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Closed loop airflow control
Contact details: Urs Ackermann, sales manager, Ph: +41032-6262086, U.Ackermann@zevac.ch, www.zevac.ch
India distributor: NMTronics India Pvt Ltd
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Model: RX6, Brand: Juki, Manufacturer: Juki Automations & Systems Corporation, Japan
Launched in September 2013, the RX6 is a high speed compact modular mounter that can place a wide variety of components on a PCB such as sub-miniature chip components, large IC components or odd-shaped components. While it improves on the features of Juki’s flexible mounters—the KE-series, its component placement speed has been improved and its size has been reduced compared to other conventional mounters.
Key features
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High productivity, flexibility and quality
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Replaceable heads that allow users to configure a production line best suited to the current requirement
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High speed component placement using high speed non-stop vision recognition
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Compact footprint with a width of just 1.25m
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Equipped with the standard placement monitor check function
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Placement speed C Chip 42,000 CPH, ICs 14,000 CPH, component size C 0402 (01005) C 100 mm sq or 50 mm x 180 mm/accuracy chip ±0.04 mm (Cpk ≥ 1), IC ±0.03mm
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Feeder capacity: C Maximum 160/Airconsumption C 100L/Min
Contact details: Akiko Kumon, inqsmt@juki.co.jp, www.juki.co.jp/smt_e
India branch: Juki India Pvt Ltd For details, refer to advertisement in this issue. See Ad Index on page 8.
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Model: MY200DX, Brand: MYDATA, Manufacturer: Micronic Mydata AB, Sweden
Launched in November 2013, the MY200 series of pick and place machines has fast changeovers and workcell solutions that reach speeds of up to 180,000 CPH.
Key features
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Ideal for high mix, high volume
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Fast set-ups and changeovers
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Full traceability down to individual PCBs
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Reliability for 24/7 production
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User-friendly and powerful software suite
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Rated speed of 40,000 CPH
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Feeder capacity of up to 160 positions
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Board size of up to 914 x 609 mm (36”×24”)
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Accuracy of 35 microns @ Cpk=1.33
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Components from 01005 chips up to large connectors
Contact details: David Koh, managing director, MYDATA Asia Pte Ltd, Ph: +65-62817997, david.koh@mydata.com.sg, www.mydata.com
India distributor: Accurex Solutions Pvt Ltd
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Model: SM 168, Brand: Samsung, Manufacturer: Samsung, South Korea
Launched in April 2013, the SM 168 achieves a high placement speed by applying a flying head mechanism with six spindles as well as an optimised pickup/placement motion.
Key features
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PCB size upto 1200 mm (option)
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25,000 CPH (optimum)
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1 gantry×6 spindles/head
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Applicable part: 1005 ~ 22mm (H 12), ~ 55mm (H 15) (option)
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~L75mm connector (option)
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Applicable PCB: 460 (L)×400 (W) (standard)
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Max. 740 (L)×460 (W) (option)
Contact details:YO Kim, global project manager, email: edmond@samsung.com
India branch: Samsung C&T Corporation India Pvt Ltd
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Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine
