Ace nanochem is looking to strengthen its presence in international markets
Ace nanochem Co., Ltd. has recently announced three materials solutions for semiconductor manufacturing, targeting power trench MOSFETs, silicon wafer surface treatment and glass through-glass via (TGV) processing. Led by CEO Jonghoon Lee, the company targets to leverage these developments to expand its business engagement with semiconductor manufacturers in Taiwan and Japan.
With more than 20 years of expertise in colloidal silica (SiO₂) nanoparticle control technology, Ace nanochem has developed the three solutions to address different requirements in semiconductor manufacturing, including selective polishing, wafer surface cleanliness and planarity in advanced packaging.
The company’s Poly-Si slurry for power trench MOSFETs is designed to achieve high removal rates of polysilicon while minimising damage to the gate oxide. The formulation aims to reduce scratches, particle generation, dishing and erosion, thereby improving polishing performance and wafer surface quality.
The second solution, a silicon bare wafer surface treatment solution, is being made for application after chemical mechanical polishing (CMP). It improves wafer surface wettability and helps prevent contamination by reducing particle adhesion. It will be used to maintain surface cleanliness for subsequent semiconductor manufacturing processes.
For advanced semiconductor packaging, Ace nanochem has developed a slurry for glass TGV processing. The solution is designed to polish materials with different physical properties, including copper bulk, barrier metal and bare glass. Its ability to process these materials together is intended to achieve the surface planarity and uniformity required for TGV manufacturing.
Building on its experience supplying semiconductor materials to major manufacturers in South Korea, Ace nanochem is looking to strengthen its presence in international markets. Taiwan and Japan are among its key target markets, given their importance to the global semiconductor industry. The company regularly participates in SEMICON TAIWAN and is pursuing technical collaborations with leading foundries to establish relationships with overseas customers and industry partners.
“These three products reflect our focus on developing semiconductor materials for demanding manufacturing processes, from power devices to advanced packaging,” said Jonghoon Lee, CEO of Ace nanochem. He added that the company aims to build on its materials technology and manufacturing capabilities to deepen technical collaboration with semiconductor manufacturers in Taiwan, Japan and other global markets.
