- The program focuses on chip implementation services and system-level design enablement solutions to help lower design barriers for customers adopting TSMC process technologies
- The Semiconductor practice of ACL Digital is a rich repository of Centre of Excellences (CoEs) in High Performance Computing (HPC), Automotive Semiconductor, Wireless Networking and IOT market segments
ACL Digital has announced that it has officially joined TSMC Open Innovation Platform (OIP) Design Center Alliance (DCA) Program. The program focuses on chip implementation services and system-level design enablement solutions to help lower design barriers for customers adopting TSMC process technologies.
Ramandeep Singh, CEO of ACL Digital said, “It’s indeed a pleasure to be a part of the TSMC DCA program. It is an endorsement that our team has been involved in for several successful tape outs in TSMC’s leading-edge process technologies. This would enable us to be better prepared for the daunting challenges that our customers face in designing complex SoCs, and would help customers meet the Power, Performance & Area (PPA) needs of the designs and time-to-market pressures. We stand committed to TSMC OIP ecosystem and look forward to more successful tape outs in future.”
Technology research, methodology, training and governance
It said that the Semiconductor practice of ACL Digital is a rich repository of Centre of Excellences (CoEs) in High Performance Computing (HPC), Automotive Semiconductor, Wireless Networking and IOT market segments. These CoEs put together best practices, technology research, methodology, training and governance all in one place to cater to its varied market segments.
Suk Lee, Vice-President of the Design Infrastructure Management Division at TSMC said, “ACL Digital’s experience in Automotive and other markets combined with their well-established semiconductor practice makes it a great addition to our DCA program. We look forward to working closely with our ecosystem partners to help our customers accelerate silicon innovations.”
