CXMT is supplying its latest LPDDR6 mobile memory to Xiaomi’s upcoming foldable, strengthening China’s push to narrow the DRAM technology gap.
China’s ChangXin Memory Technologies (CXMT) is set to supply its latest LPDDR6 dynamic random access memory (DRAM) chips for Xiaomi’s upcoming flagship foldable smartphone, marking a new step in the Chinese memory maker’s push into advanced mobile memory.
CXMT said it has started mass production of LPDDR6 and will supply the chips for Xiaomi’s upcoming 18 Fold smartphone. Xiaomi has also confirmed the partnership, with the device scheduled to launch in September.
The LPDDR6 chips represent CXMT’s most advanced DRAM technology for mobile applications. The company has moved to the new generation less than a year after beginning mass production of LPDDR5 memory, highlighting its efforts to close the technology gap with leading global memory manufacturers such as Samsung and SK Hynix.
The Xiaomi 18 Fold is also expected to feature an upgraded version of Xiaomi’s in-house Xring O3 processor, manufactured using a 3-nanometre process. The processor is designed to support LPDDR6 memory.
CXMT has said its LPDDR6 memory samples have already been shipped to customers for applications spanning smartphones, servers and smart vehicles.
The development comes as CXMT expands rapidly in the memory semiconductor market. The company reported a sharp turnaround in the first half of 2026, with revenue rising 874 per cent year-on-year to 150.3 billion yuan.
CXMT’s growing presence in advanced DRAM also comes amid increasing geopolitical pressure. The company recently challenged its inclusion on a US list identifying companies alleged to have links to China’s military.
