EnSilica, SIAE Collaborate On Next-Gen Wireless Chips

Eyeing to minimise risks while boosting power efficiency and cost savings, SIAE MICROELETTRONICA has teamed up with EnSilica to revolutionise telecommunications through Application-Specific Integrated Circuits.

SIAE MICROELETTRONICA, a telecom service provider based in Italy, has partnered with fabless chip designer EnSilica to develop application-specific integrated circuits (ASICs) for its upcoming telecommunication infrastructure products.

A crucial aspect of this ten-year partnership is reducing development risk by integrating SIAE’s designs into custom ASICs. Moreover, the collaboration will facilitate the advantages of ASICs, including reduced power consumption, lower costs, and smaller size, while securely safeguarding valuable intellectual property within the ASIC.

EnSilica’s experience in high-performance radio frequency (RF) systems and its robust supply chain management were key factors in securing the contract.

Furthermore, SIAE aims to enhance its portfolio, which includes a wide range of microwave and millimetre-wave radio solutions, by supporting the development of innovative modem chips and components for the mobile communications sector.

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The collaboration will contribute to technological advancements and new product offerings aligned with its ‘IPCEI EMISPHERE’ programme. The European Commission sponsors this project to support research, innovation, and the industrial diffusion of microelectronics and communication technologies.

Paul Morris, VP of EnSilica’s RF and Communications Business Unit, expressed enthusiasm about SIAE MICROELETTRONICA choosing their offerings. He emphasised the growing importance of ASICs for advanced telecommunications systems amid rising demands for higher data rates and energy efficiency.

Claudio Passera, SIAE MICROELETTRONICA’s Group R&D Director, noted, “This unique combination positions us to develop innovative platforms and products that address the critical needs of emerging applications beyond 5G.” He expressed confidence that the deal would provide a competitive edge in the wireless network sector.

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Shubha Mitra
Shubha Mitra
Shubha Mitra is an Assistant Editor at EFY, keenly interested in policies and developments shaping the electronics business.

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