The $300 million equity investment is subject to customary closing conditions and regulatory approvals
FormFactor and Teradyne have entered into a broad technology collaboration to accelerate the development, validation, and high-volume production of next-generation semiconductor devices. As part of the agreement, Teradyne will make a $300 million strategic equity investment in FormFactor.
The collaboration combines FormFactor’s expertise in semiconductor probe technologies, interface solutions, test engineering, and device characterisation with Teradyne’s automated test equipment and platforms. The companies aim to develop advanced semiconductor test architectures, optimise test infrastructure, and improve production readiness for increasingly complex devices.
The collaboration will focus on applications including high-performance computing (HPC), advanced packaging, high-bandwidth memory (HBM), and silicon photonics. These technologies are becoming increasingly important as demand for artificial intelligence (AI) computing and data centre infrastructure grows.
According to the companies, the partnership will help semiconductor manufacturers address testing challenges across the development and production lifecycle, from wafer-level testing to data-centre deployment. It will also support joint customer engagement and efforts to establish a more integrated and interoperable semiconductor test ecosystem.
FormFactor CEO Mike Slessor said the collaboration would combine the companies’ complementary capabilities to help customers accelerate innovation and move more efficiently from technology development to high-volume manufacturing.
Teradyne President and CEO Gregory Smith said the strategic investment and technology partnership would help address complex testing requirements in advanced packaging, silicon photonics, and memory while providing customers with a more complete path to production.
The $300 million equity investment is subject to customary closing conditions and regulatory approvals. The companies expect the collaboration to support the growing requirements of advanced computing, AI infrastructure, and next-generation semiconductor technologies.
