The agreement will combine Qualcomm Technologies’ high-performance SoC, with Infineon’s expertise in hardware and software for safety management and connectivity.
Infineon has signed a technology agreement with Qualcomm to expand its Snapdragon ride ecosystem for high performance computing and in-vehicle artificial intelligence. The agreement will combine Qualcomm Technologies’ high-performance SoC, with Infineon’s expertise in hardware and software for safety management, connectivity and memory management.
The final aim is to provide a pathway for developing car computers that combine driver assistance and automated driving functions with cutting-edge cockpit solutions. They will also develop a microcontroller-based subsystem, designed to operate along Qualcomm’s Snapdragon Ride and Ride Flex platforms.
The subsystem, built around Infineon AURIX microcontroller, with Infineon OPTIREG ICs providing dependable Power management, is expected to coordinate with AI capabilities of the Snapdragon Ride Platform, to provide reliable vehicle behaviour, by monitoring system health, and coordinating safety mechanisms.
The microcontroller-based subsystem will help Tier-1 car manufacturers to develop and scale quickly. The microcontroller will work seamlessly with the overall platforms, including the SoC and its own safety mechanisms. Further on the software package will help platform integration into vehicle networks such as Ethernet and CAN for faster data exchange with other systems.
“Our collaboration reflects a fundamental approach to centralized vehicle computing, which combines a powerful SoC with a set of specialized components around it, including a safety microcontroller, power management, connectivity and memory devices,” said Peter Schiefer, President of the Automotive Division at Infineon.
