The approach is intended to simplify broadband measurements for semiconductor research and device development
Keysight Technologies has collaborated with the University of Glasgow, the UK’s National Physical Laboratory (NPL), and MPI Corporation to demonstrate a broadband approach for characterising next-generation sub-terahertz semiconductor devices.
The organisations demonstrated continuous on-wafer characterisation of indium phosphide high-electron-mobility transistors (InP HEMTs) from near DC to 250 GHz in a single sweep. The approach is intended to simplify broadband measurements for semiconductor research and device development at millimetre-wave and sub-terahertz frequencies.
As semiconductor technologies move towards higher frequencies, engineers require accurate transistor measurements across increasingly wide frequency ranges. Conventional characterisation methods can require multiple measurement setups and calibrations, potentially adding complexity and creating inconsistencies in data used for broadband device modelling.
For the demonstration, Keysight contributed its PNA-X Vector Network Analyser, Single-Sweep 250 GHz Frequency Extender, and Precision Source/Measure Unit (SMU). The University of Glasgow provided InP HEMT devices and on-wafer calibration standards, while MPI Corporation contributed broadband on-wafer probing technology and calibration software. NPL provided high-frequency metrology and calibration expertise.
The combined setup enabled continuous measurements from near DC to 250 GHz with a single probe touchdown. This eliminates the need for multiple setup changes and enables consistent broadband S-parameter measurements across the frequency range.
The system also incorporates source filtering and broadband source power calibration to help maintain signal purity at the probe tip during millimetre-wave measurements.
Keysight said the collaboration demonstrates a practical approach to generating consistent broadband measurement data that can help researchers accelerate the development of next-generation semiconductor devices.
According to NPL, accurate on-wafer measurement and calibration become increasingly important as semiconductor technologies move further into millimetre-wave and sub-terahertz frequency ranges.
MPI Corporation added that integrating probing, calibration, and measurement capabilities into a single system can help researchers simplify on-wafer characterisation while improving measurement consistency at frequencies up to 250 GHz.
