Polymatech Electronics acquires Nisene Technology’s Silicon and Silicon Carbide wafers to develop a unique multi-wafer technology, enhancing its position in semiconductor chip fabrication and testing.
Polymatech Electronics, India’s semiconductor chip manufacturer, has significantly enhanced its capabilities by acquiring Nisene Technology Group Inc., based in California, USA. This acquisition, executed through Polymatech’s Singapore-based subsidiary, Artificial Electronics Intelligent Materials Pte Ltd., aims to strengthen its position in semiconductor chip fabrication and testing.
By integrating Nisene’s expertise in Silicon and Silicon Carbide wafers with its Sapphire-based technology, Polymatech plans to develop a unique multi-wafer technology, setting a new standard in the industry.
Polymatech Electronics will maintain its production of Sapphire wafers using new advanced technology from leading European suppliers. These cutting-edge tools will arrive at Polymatech’s facility by January 2025.
The new European technology, which features a faster and more efficient method for growing Sapphire, prompted Polymatech to switch from its previous agreement with Orbray. The European partner will also provide the latest Silicon Carbide wafer technology, further enhancing Polymatech’s semiconductor capabilities.
The company is set to invest up to US $500 million to expand its operations. The company plans to produce Silicon Carbide and Sapphire wafers and high-performance CPUs and GPUs for PCs and mobile devices.
Additionally, Polymatech will develop advanced networking chips designed to support the latest Wi-Fi and 6G standards. With this substantial investment, Polymatech aims to achieve a revenue target of US $5 billion by 2030, solidifying its position as a significant player in the semiconductor industry.
