The Japanese chipmaker unveils Rapidus CORE framework alongside 17 design partners to bridge early-stage silicon development and mass production.
Japanese semiconductor venture Rapidus has launched the Rapidus Collaborative Open Rapid Ecosystem (CORE)—a global alliance structure designed to support the development and volume production of next-generation semiconductors.
The initiative integrates the entire semiconductor value chain, uniting research institutions, electronic design automation (EDA) providers, intellectual property (IP) vendors, design houses, and foundries into a unified development infrastructure.
Facing an ongoing global shortage of specialized semiconductor engineering talent, the CORE framework aims to lower technical barriers by allowing clients to initiate early-stage chip designs through structured collaboration with specialized partners.
As part of the initial phase, Rapidus formed the Design Solution Associates group, featuring 17 global design specialists tasked with bridging the gap between chip clients and Rapidus foundries. The inaugural cohort comprises AION Silicon, Cadence Design Systems, Dai Nippon Printing, GreatAsic Technology, HCL Technologies, Infinecs Systems, Infosys, MavissDesign, MosChip Technologies, NSW, Oppstar Technology, Quest Global Services, SkyeChip, Synopsys, TOPPAN, Toshiba Information Systems, and Wipro.
Moving forward, Rapidus plans to expand the CORE platform into additional technical categories—including EDA tools and IP licensing—to strengthen global supply chain partnerships and accelerate the commercialisation of advanced 2nm logic nodes.
