The collaboration comes as semiconductor design teams face increasing complexity and pressure to shorten development cycles
Siemens and TSMC are expanding their collaboration to advance AI-powered automation and semiconductor design enablement, with a focus on improving productivity and accelerating design cycles amid growing chip design complexity.
The companies are building on their longstanding relationship within the TSMC Open Innovation Platform (OIP) ecosystem to expand design enablement across semiconductor design workflows. The collaboration is aimed at helping mutual customers reduce manual effort, improve productivity, and accelerate time-to-tapeout.
As part of the expanded collaboration, Siemens and TSMC have enabled an AI-powered agent for automated design rule check (DRC) fixing across digital and custom integrated circuit (IC) design flows. The agent is powered by Siemens’ Calibre software and integrated with Aprisa and Solido software.
The companies are also working to advance AI-powered semiconductor design through Siemens’ Fuse EDA AI System and Fuse EDA AI Agent. These technologies are designed to enable autonomous, long-running, and self-verifying electronic design automation (EDA) workflows.
The agentic workflows can reason across multi-step design tasks, coordinate actions across multiple EDA tools, and continuously validate and improve engineering outcomes. Fuse EDA AI Agent is also enhanced by NVIDIA AI technologies to improve token efficiency, reasoning, and execution across long-running engineering workloads.
The collaboration comes as semiconductor design teams face increasing complexity and pressure to shorten development cycles. Siemens and TSMC said the expanded design enablement efforts are intended to help engineers automate repetitive tasks and manage complex semiconductor design workflows more efficiently.
