The latest in board handling systems

Friday, October 11, 2013: Using machines instead of people to move PCBs during the assembly process not only results in higher productivity, but can also add up to significant cost reductions. By using board handling and transport systems, all PCB assemblers, regardless of size, can realise these benefits while maximising the automated capabilities of their inline equipment. Using SMEMA (Surface Mount Equipment Manufacturers Association) standards for machine-to-machine communication, players offer an extensive range of board handling systems like transporters, conveyors, buffers, loaders, unloaders, line dividers, combiners and more.

Model: Automatic loader/unloader, conveyors, Brand: YJ Link, Manufacturer: YJ Link Co Ltd, South Korea
Launched in January 2013, the YJ Link loader is used to push and stack PCBs inside the magazine to the next machine process, whereas the unloader unit pushes the PCB into the magazine from the previous process. The link conveyor and work tables are used to connect different machines in the SMT line process and to automatically transfer the PCB.

Key features
SMEMA interface
Touchscreen operation
Durable structure because of double-base plate
Buzzer, SMEMA interface and LED display
ESD cover, safe from dust particles
Dual-clamping system to prevent magazine warping
Customised manufacturing
Available in five variants for different PCB sizes
Single-lane and dual-lane PCB flow option
PCB damage prevention

Contact details: Paul Kim, sales manager, Ph: +82-53-5921723, tk_paul@yjlink.com, www.yjlink.com
India distributor: NMTronics India Pvt Ltd
___________________________________________________________________________________
Model: VEGO dynamic loading (LSB 03), Brand: ASYS, Manufacturer: ASYS, Germany

Released in the market in December 2012, the VEGO Dynamic PCB DE Stacker Loading System (LSB 03) is used to load bare boards for printing or marking the SMT production lines. The PCB stack is manually loaded into the machine, and the individual PCBs are handed over to the downstream system on a transfer conveyor. What makes the new VEGO LSB 03 unique is the combination of new features that enable the processing of an expanded range of products without costly manual adjustments. Whether thin, thick, rigid, flexible, with or without breakouts, the new solution is suitable for all types of printed circuit boards (PCBs).

Key features
Graphical user interface
Product memory function
Processing of the stack from the top
No PCB length or thickness data required
Electrical width adjustment
Two-colour signal lamp (LED) and alarm horn
Small footprint

- Advertisement -

Contact details: Parvindar Singh, managing director, Singapore, Ph: +65-62808887, Mob: +65-97515989, psingh@asysgroup-asia.com, www.asys.de/
India distributors: American Tec, DVS India, EMST Marketing Pvt Ltd, Innotronics Technologies Pvt Ltd

___________________________________________________________________________________
Model: VEGO compact handling unloading systems (BUL 03), Brand: ASYS, Manufacturer: ASYS, Germany

Launched in December 2012, this line unloader unloads PCBs from upstream and loads them into magazines. The magazine platform can accommodate more than one magazine. The integrated side shuttle distributes boards to the magazine. Once a PCB is loaded, the magazine platform will index to the next slot. The new solution is suitable for all types of PCBs, whether thin, thick, rigid, flexible, and with or without breakouts.

Key features
Light tower, single-stage with buzzer
Anti-static conveyor belts
SMEMA interface

Contact details: Parvindar Singh, managing director, Singapore, Ph: +65-62808887, Mob: +65-97515989, psingh@asysgroup-asia.com, www.asys.de/
India distributors: American Tec, DVS India, EMST Marketing Pvt Ltd, Innotronics Technologies Pvt Ltd

___________________________________________________________________________________
Model: VEGO compact handling loading systems (BLO 03), Brand: ASYS, Manufacturer: ASYS, Germany

Launched in December 2012, this line loader loads PCBs from magazines into the line. The magazine platform can accommodate more than one magazine and cycles into the position. The system offers a unique way to pull out the PCBs from the magazines. The side shuttle aligns the PCB system, ensuring process stability and excellent durability.

Key features
Light tower, single-stage with buzzer
Anti-static conveyor belts
SMEMA interface

Contact details: Parvindar Singh, managing director, Singapore, Ph: +65-62808887, Mob: +65-97515989, psingh@asysgroup-asia.com, www.asys.de/
India distributors: American Tec, DVS India, EMST Marketing Pvt Ltd, Innotronics Technologies Pvt Ltd

___________________________________________________________________________________

Electronics Bazaar, South Asia’s No.1 Electronics B2B magazine

- Advertisement -
Loading form…

Industry's Buzz

PC and laptops

Component Inflation to Trigger 22% Drop in Indian PC Market

0
Early buying and rising component costs set to curb second-half PC shipments following advanced inventory stocking. India’s PC market faces a sharp 22 per cent...
Rapidise

Rapidise To Quadruple Electronics Manufacturing Capacity In Manesar

0
Rapidise is quadrupling its Manesar electronics manufacturing capacity through a ₹200 crore investment, adding SMT lines and automated systems to support complex PCB assemblies,...

Iridium and Skylo Top 2026 Satellite IoT Connectivity Rankings

0
Market shifts towards mainstream enterprise adoption as satellite providers scale hybrid connectivity and standards-based networks.  Iridium and Skylo have been named ‘Pacesetters’ in Counterpoint Research’s...
E-waste

E-Waste Fraud Exposes Haier, Godrej, and Blue Star

0
Indian tax authorities fault major appliance makers over fabricated e-waste recycling claims and improper tax credits. Indian tax authorities have faulted major home appliance manufacturers...
TSMC

TSMC Weighs Potential Texas Expansion to Boost US Production

0
World’s largest contract chipmaker evaluates additional US manufacturing footprint alongside $265bn Arizona commitment. Taiwan Semiconductor Manufacturing Co (TSMC), the world’s largest contract chipmaker, is evaluating...

Learn From Leaders

Does India’s Chip Packaging Growth Need Local Materials At Scale?

0
What will it take for specialised semiconductor materials manufacturing to grow in India? Packaging volumes will be a key factor as OSAT facilities move...
Ronak Kumar Samantray, Founder, TM2Space Technologies Pvt Ltd.

“Our goal is to build data centres in space.” – Ronak Kumar Samantray, TM2Space

0
A space startup aims to build orbital data centres, letting users run AI models and store data on satellites while also supplying satellite hardware...

India’s Photonics Puzzle Is Finally Coming Together 

0
Can India turn its scattered photonics capabilities into a stronger industry? A new association aims to connect the ecosystem and strengthen the domestic value...
Jin Bains, CEO, Mini-Circuits

Mini-Circuits CEO Jin Bains on Navigating High-Frequency Component SWaP-C Constraints, Emerging Markets, and Career...

0
In this exclusive, Jin Bains, Chief Executive Officer (CEO) of Mini-Circuits, explains in a conversation with Dilin Anand of EFY about areas of emerging...

India Needs Not a Hundred, But Thousands of Chip Diversified Companies 

0
Can India build a semiconductor ecosystem beyond fabs? Indiesemic believes thousands of diversified chip companies are needed to make that possible. India’s semiconductor push is...

Startups

Jash Jetly, Co-founder and CEO of EVE

“The cloud isn’t the only way to run AI. We’re proving it can happen...

0
A startup is building a decentralised AI and communication network that runs across everyday devices instead of centralised cloud servers. In an interview, Jash...
Mohit Gupta, founder and CEO, TYLsemi

Building AI Chips, One Block at a Time 

0
What if building an AI chip became as simple as assembling reusable blocks? The startup is working to make custom silicon accessible beyond the...
Seema Johar, Co-Founder and Product Director, Compcarta Solutions Pvt Ltd

“We Let Designers Focus on Innovation, Not Infrastructure.”- Seema Johar, Compcarta Solutions

0
In an exclusive interview, Seema Johar of Compcarta speaks with EFY’s Akanksha Sondhi Gaur about why setting up an EDA environment can be harder...

Space Solar Secures $1.7m ARIA Contract for Wireless Power Beaming

0
Harwell-based firm to develop ground-to-air RF beaming technology for persistent high-altitude platforms. Harwell-based wireless power specialist Space Solar has secured a $1.7 million (£1.3 million)...
Mohit Gupta, Founder and CEO, TYLsemi

“We are democratising custom silicon with reusable chiplets, enabling more companies to build their...

0
In an exclusive interview,Mohit Gupta from TYLsemi explains to Saba Aafreen from Electronics For You as to why the future of AI infrastructure will...