Powering ahead, TSMC is dominating EUV market with 56% share reportedly. While it solidifies its lead in semiconductor technology, Samsung Foundry looks to compete too.
Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly cemented its leadership in semiconductor manufacturing, expanding its share of global extreme ultraviolet (EUV) lithography systems from 50% to 56% between 2020 and 2023.
According to the South China Morning Post, this increase highlights the company’s growing dominance in the semiconductor industry. EUV lithography plays a crucial role in producing the advanced chips powering modern technology.
EUV lithography systems are among the most expensive tools in semiconductor production, each costing over $100 million. While TSMC and its partner ASML have not disclosed the exact number of EUV systems in use, reports from AnandTech and The Register suggest TSMC’s EUV system installations have surged significantly in recent years. Industry players estimate TSMC acquired 84 EUV systems in 2022 and over 100 in 2023.
TSMC began using EUV technology in 2019 with its N7+ process, the first to employ EUV for commercial production. Since then, EUV has been integrated into its N5 and N3 processes, and by 2023, TSMC’s EUV system base had increased tenfold.
However, TSMC is cautious about adopting high-NA EUV systems. It plans to evaluate them based on maturity, cost, and customer benefits, ensuring it stays ahead in semiconductor manufacturing while managing risks.
On the other hand, Samsung Foundry has also incorporated EUV into its own manufacturing processes, including its 7LPP, 5nm, and 3nm technologies, further demonstrating the growing importance of EUV in the global semiconductor landscape.
