World’s largest contract chipmaker evaluates additional US manufacturing footprint alongside $265bn Arizona commitment.
Taiwan Semiconductor Manufacturing Co (TSMC), the world’s largest contract chipmaker, is evaluating a potential investment in Texas to expand its semiconductor production capabilities in the United States. According to two sources familiar with the matter, any potential project in Texas would come in addition to the $265 billion the company has already committed to its Arizona operations.
The expansion plans have not been finalised, and TSMC declined to comment on the reports, which first emerged in Taiwanese media. The company has steadily expanded its North American manufacturing footprint, having announced a further $100 billion commitment in July to bring its total Arizona investment to $265 billion.
The planned Arizona buildout comprises 12 wafer fabrication and advanced packaging facilities, as well as a dedicated research and development centre. Emphasising TSMC’s long-term strategy, Chief Executive C.C. Wei previously indicated that “probably additional four or more fabs will be built,” encompassing both front-end and back-end production facilities.
An expansion into Texas would mark a major diversification of TSMC’s US operations beyond its primary hub in Phoenix. Speaking on the company’s capital expenditure strategy in July, Chief Financial Officer Wendell Huang confirmed that TSMC would “continue to invest in the United States” to support client demand and strengthen global supply chain resilience.
