Samsung’s fifth-generation HBM3E chips pass Nvidia’s tests, gaining approval for use in AI processors and marking a significant advancement in Samsung’s memory technology for AI.
Samsung Electronics’ new fifth-generation high-bandwidth memory (HBM3E) chips have passed Nvidia’s testing for AI processors, a significant advancement for the South Korean tech giant.
This qualification is an essential step for Samsung, which has struggled to match the pace of competitor SK Hynix in providing advanced memory solutions for AI applications.
While Samsung and Nvidia have not yet finalised a supply agreement, they are expected to begin deliveries of the approved eight-layer HBM3E chips by the fourth quarter of 2024.
However, Samsung’s 12-layer HBM3E chips have not yet received Nvidia’s approval. The company has faced heat and power consumption challenges but has made design improvements to address these issues.
The HBM3E chips are crucial for processing large volumes of data required by complex AI systems. As demand for such chips surges due to the generative AI boom, Samsung aims for HBM3E to constitute 60% of its HBM sales by year-end.
Meanwhile, SK Hynix continues to lead the market with its 12-layer HBM3E chips, which it has already begun shipping. Micron also plans to supply HBM3E chips to Nvidia.
