Culminating in Germany’s partnership for ELECRAMA 2027, NXP Semiconductors’ Noida roundtable united German and Indian leaders to explore semiconductor cooperation.
NXP Semiconductors hosted a roundtable event in Noida last week, welcoming policymakers and industry leaders from Germany and India. It held open discussions on potential semiconductor cooperation between the two countries in technology, automotive, and other vital sectors.
Among the attendees were NXP Chief Technology Officer Lars Reger and H.E. Robert Habeck, Germany’s Vice-Chancellor and Federal Minister of Economic Affairs and Climate Action.
During the event, Minister Habeck and Vikram Gandotra, President of the Indian Electrical and Electronics Manufacturers’ Association (IEEMA), signed a joint declaration designating Germany as the partner country for the electronics trade expo ELECRAMA 2027. Habeck emphasised the strong potential for collaboration, noting that Germany’s technological expertise complements India’s robust manufacturing ecosystem.
The event also featured technology demonstrations from NXP and innovative solutions from Indian and Asian startups, showcasing advancements in electric vehicle motorbikes, artificial intelligence, smart manufacturing, and 6G applications.
The gathering coincided with the Indo-German intergovernmental consultations and the 18th Asian-Pacific Conference of German Business, attracting ministers and business leaders from both nations. The informal format allowed for candid discussions on India’s growth markets, emerging technology trends, and collaborative opportunities.
Hitesh Garg, NXP’s India Country Manager, remarked “This event at our Noida office is a testament to NXP’s unwavering commitment to promoting international cooperation and maintaining a healthy, ongoing dialogue and synergy. Deepening cross-regional collaborations allows our industry to elevate and foster innovation and technological advancements.”
NXP’s Noida site is a Center of Excellence for hardware and software design, focusing on edge and automotive processing.
