Eyeying massive job growth and driving India’s semiconductor goals, Andhra Pradesh inks ₹140 billion deal for India’s first private SiC semiconductor fab with Indichip and its Japanese partner YMTL.
Andhra Pradesh is to house India’s first private silicon carbide (SiC) semiconductor fabrication unit. The state has signed a Memorandum of Understanding (MoU) for the ₹140 billion project with Indichip Semiconductors and its joint venture partner Yitoa Micro Technology Limited (YMTL) of Japan. The unit will be set up at Orvakal Industrial Park in Kurnool district.
The facility will focus on producing SiC chips, with a monthly production capacity of 10,000 wafers. Over the next two to three years, production is expected to scale up to 50,000 wafers per month.
According to a report by The New Indian Express, this move further aligns with India’s ambitions to boost its semiconductor manufacturing capabilities, especially in energy-efficient technologies, electric vehicles, and renewable energy solutions.
The initiative also falls under the Andhra Pradesh Semiconductor and Display Fab Policy 2024-29, which aims to make the state a major hub for electronics and semiconductor manufacturing.
The MoU was signed by Piyush Bichhoriya, Managing Director of Indichip, and Saikanth Varma, CEO of the Andhra Pradesh Economic Development Board (APEDB), in the presence of other dignitaries, including HRD and IT Minister Nara Lokesh and Industries Minister TG Bharath.
Minister Lokesh highlighted the state’s ability to attract high-tech industries through its progressive policies and strong infrastructure. Minister Bharath noted that the facility would not only generate thousands of jobs but also foster innovation and the growth of related industries, positioning Andhra Pradesh as a manufacturing powerhouse.
Indichip’s Director, Sandeep Garg, emphasised that the project would drive technological advancement while supporting India’s sustainability goals by addressing the increasing demand for energy-efficient solutions.
