Driving the chip race forward, ISM’s four new projects promise India big investments and thousands of jobs.
The Union Cabinet has approved four additional semiconductor manufacturing projects under the India Semiconductor Mission with a cumulative investment of around ₹46 billion. This marks a significant step in strengthening the nation’s semiconductor ecosystem.
The new projects are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc, and Advanced System in Package (ASIP) Technologies. These projects will generate 2,034 skilled jobs, alongside numerous indirect employment opportunities.
With these approvals, the total number of sanctioned projects under ISM has reached 10, with investments totalling approximately ₹1.60 trillion across six states.
Two of the new facilities, SiCSem and 3D Glass Solutions, will be established in Odisha’s Info Valley, Bhubaneshwar. SiCSem, in collaboration with UK-based Clas-SiC Wafer Fab Ltd, will set up India’s first commercial compound semiconductor fab, with an annual capacity of 60,000 wafers and 96 million packaged units, targeting sectors like defence, EVs, railways, and renewable energy.
3D Glass Solutions will introduce advanced packaging and embedded glass substrate technology, with capacities including 69,600 glass panel substrates and 50 million assembled units annually, for applications in AI, photonics, defence, and high-performance computing.
In Andhra Pradesh, ASIP Technologies, in partnership with South Korea’s APACT Co. Ltd, will establish a manufacturing unit with a capacity of 96 million units per year, serving mobile, automotive, and consumer electronics markets. In Punjab, CDIL will expand its Mohali facility to produce 158.38 million high-power discrete semiconductor devices annually, including MOSFETs, IGBTs, and Schottky diodes.
Dr Ajai Chowdhry, Founder HCL, Chairman EPIC Foundation, asserted, “India’s semiconductor sector is poised for a quantum leap with four key major project approvals SiCS, 3DGS, CDIL, and ASIP. It is good to see that we now will have compound semiconductor fab, which will cater to power sector needs and glass-based OSAT for display needs. Building on its strong chip design foundation, India is now set to turbocharge indigenous manufacturing cutting down on reliance on foreign imports.”
