Bastecki joined Indium Corporation in 2011 as Director of Electronic Assembly Materials
Indium Corporation has promoted Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global PCB Assembly Materials Marketing. In his expanded role, Bastecki will lead customer-facing operations across the Americas, including sales, inside sales, and technical support.
He will also continue to oversee the company’s global PCB Assembly Materials business, including product management and marketing for solder pastes, cored and solid wire, wave and selective solder fluxes, and bar solder products.
Bastecki joined Indium Corporation in 2011 as Director of Electronic Assembly Materials and has since contributed to the growth of its PCB Assembly Materials business. During his tenure, the company introduced technologies including the Indium8.9HF solder paste platform, Durafuse LT low-temperature solder technology, Durafuse HR high-reliability solder technology, and Indalloy 291 and Indalloy 302 low-silver alloy families.
In his new role, Bastecki will focus on strengthening customer engagement, product strategy, and market growth across the Americas while continuing to support Indium Corporation’s global PCB assembly materials business.
Bastecki holds a bachelor’s degree in metallurgical engineering from the University of Pittsburgh and an MBA from Carnegie Mellon University. He is based in Atlanta, Georgia.
