Infineon has equipped NIELIT Ahmedabad’s new semiconductor CoE with eight industry-grade machines to provide hands-on backend manufacturing training as India expands its ATMP and OSAT capacity.
The National Institute of Electronics and Information Technology (NIELIT) and Infineon Technologies have inaugurated a Centre of Excellence (CoE) on Semiconductor Manufacturing at NIELIT Ahmedabad, Gujarat, to provide hands-on training in semiconductor backend manufacturing.
The CoE was inaugurated virtually on September 16, 2026, by Shri Jitin Prasada, Union Minister of State for Electronics & Information Technology and Commerce & Industry. Infineon is providing eight industry-grade machines for the facility, covering die bonding, wire bonding, moulding, trimming and lead forming.
The equipment includes two ASM AD838 Die/Glue Bonders, two SHINKAWA UTC1000 Wire Bonders, two BESI FICO Moulding Machines and two BESI FICO Trim-and-Form Machines. The training line will give diploma holders, engineering students, technicians, working professionals, faculty and researchers practical exposure to semiconductor assembly and packaging processes.
The initiative comes as India expands its semiconductor manufacturing, Assembly, Testing, Marking and Packaging (ATMP), and Outsourced Semiconductor Assembly and Test (OSAT) capabilities, increasing demand for personnel who can operate, maintain and optimise manufacturing equipment.
Shri Jitin Prasada said that “when a global industry leader places its production equipment in the hands of Indian students and faculty, it reflects confidence in the capabilities and potential of India’s youth.”
Infineon CEO Jochen Hanebeck said India is an important strategic growth market and part of its global innovation network. He said the equipment would form the technological core of the CoE and support practical learning aligned with industrial practices.
NIELIT Director General Dr. Madan Mohan Tripathi said the partnership would bridge academic learning and industrial requirements. NIELIT Ahmedabad is also intended to serve as a model for replication through NIELIT’s national network. The partnership began with an understanding signed on March 17, 2025.
