Hanmi Semiconductor has won an $18.2 million order from Samsung Electro-Mechanics for MSVP equipment to support AI semiconductor substrate production. The deal could reopen a broader Samsung Group business relationship.
Hanmi Semiconductor has secured a 24.48 billion won ($18.2 million) contract from Samsung Electro-Mechanics to supply Micro SAW & Vision Placement (MSVP) equipment, marking its first large-scale equipment transaction with a Samsung Group affiliate after years of limited business ties.
The MSVP system combines semiconductor package sawing, cleaning, drying, optical inspection, sorting, and placement in a single back-end process. The equipment will be used for AI semiconductor substrate manufacturing and can support production involving DRAM, NAND flash, HBM, system semiconductors, PCBs, and glass substrates.
The order comes as Samsung Electro-Mechanics plans to invest 4.27 trillion won ($3.2 billion) at its Sejong facility to expand FCBGA capacity for high-performance semiconductor substrates used in AI servers. The new plant is scheduled to begin operations in September 2028.
The deal also points to a possible restoration of Hanmi Semiconductor’s relationship with Samsung Group. The two sides’ business ties had weakened after Hanmi won a 2012 patent lawsuit against Secron, then a Samsung Electronics subsidiary and now Semes.
Hanmi has primarily supplied HBM TC bonders to SK Hynix and Micron, with virtually no Samsung Electronics business in this area. The MSVP order could therefore provide an entry point for broader Samsung business, although any future TC bonder supply to Samsung Electronics remains uncertain.
Hanmi’s MSVP business is also growing rapidly, with more than 200 units sold in 2026 and January-August revenue already exceeding its full-year 2025 revenue. Including this order, its four disclosed 2026 supply contracts total 86.2 billion won ($64.2 million), up 39.8% year-on-year.
