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Headlines
SK Hynix Backs Optical Interconnects for AI
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Jaydeep Gadhavi
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August 24, 2026
South Korean memory maker backs co-packaged optics to replace copper links and break the 'AI memory wall' in data...
Finnish SAR Imagery Specialist Forms Its India Unit
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Jaydeep Gadhavi
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August 24, 2026
The formation of ICEYE India follows the formation of its German subsidiary last month. The move aims to tap...
Europe-China Differences Leads to a Split in Nexperia
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Jaydeep Gadhavi
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August 24, 2026
The Dutch chipmaker’s China unit said that a new production line which will produce 12-inch silicon wafer up to...
Kaynes Technology, BOSGAME Sign MoU To Expand In India
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Nitisha Dubey
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August 24, 2026
The partnership will also explore opportunities for product localisation, value addition, and greater participation in India’s growing electronics ecosystem Kaynes...
Exclusive Articles
SK Hynix Backs Optical Interconnects for AI
Finnish SAR Imagery Specialist Forms Its India Unit
Europe-China Differences Leads to a Split in Nexperia
Kaynes Technology, BOSGAME Sign MoU To Expand In India
India, Japan to Deepen Semiconductor and AI Cooperation During Goyal’s Visit
Xiaomi Unveils Next-Generation Xring O3 Chip in Partnership With TSMC
India’s Semiconductor Market Seen Reaching $155 Billion by CY31
India’s Electrical and Electronics Sector Steps Up R&D Investment
MPMS: Approximately a $7 Billion Scheme to Boost Mobile Phone Manufacturing
India’s R&D spending rises, but research intensity remains below 1% of GDP
SK Hynix Backs Optical Interconnects for AI
Buzz
Jaydeep Gadhavi
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August 24, 2026
Finnish SAR Imagery Specialist Forms Its India Unit
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Jaydeep Gadhavi
-
August 24, 2026
Europe-China Differences Leads to a Split in Nexperia
Buzz
Jaydeep Gadhavi
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August 24, 2026