South Korean memory maker backs co-packaged optics to replace copper links and break the ‘AI memory wall’ in data centres.
South Korean semiconductor giant SK Hynix is throwing its weight behind optical interconnects and co-packaged optics (CPO) as the primary technology to break the ‘AI memory wall’.
In a research paper co-authored alongside academic researchers from institutions including the University of Virginia and MIT, the firm examined how light-based links could power next-generation AI platforms.
The study identifies replacing standard copper interconnects with optical connections as the most viable path towards long-term scalability.
Whilst CPO has gained traction for accelerating chip-to-chip links inside compute trays, SK Hynix views it as a way to extend optical interconnects directly to the memory interface.
The paper outlines an optics-centric architecture that uses photonic interposers to connect processors directly to shared memory pools.
This approach maximises data transfer efficiency, allowing multiple AI accelerators to access memory at far higher speeds than conventional storage connections permit.
University of Virginia Professor Kyusang Lee noted that extending optical links directly to memory bypasses physical constraints around compute chips.
This removes limitations on electrical connections and memory capacity, ensuring AI infrastructure remains adaptable as computational model sizes scale.
Rapidly escalating hardware costs and ongoing memory shortages stem largely from the sheer scale of demand from AI data centres.
While AI accelerators have seen substantial performance boosts, high-bandwidth memory consumes significantly more silicon wafer capacity per gigabit, creating supply constraints and performance bottlenecks.
SK Hynix’s strategic backing of CPO aims to ensure the long-term viability of its primary product lines.
Seunghoon Hong, AI infrastructure team lead at SK Hynix, emphasised that as clients construct larger AI clusters, the role of optical interconnects will become increasingly vital.
He noted that memory suppliers are shifting from component vendors to partners providing system-level competitiveness, highlighting plans to foster open ecosystem collaborations across the industry.
