Indian tech company eInfochips announces to join the Design Center Alliance of TSMC Open Innovation Platform to boost advanced solutions in the semiconductor sector.
On Saturday, eInfochips, a subsidiary of Arrow Electronics, revealed its membership in Taiwan Semiconductor Manufacturing Company’s (TSMC) Open Innovation Platform’s Design Center Alliance (DCA). This partnership will provide advanced solutions in chip design and testing, benefitting mutual customers, hopes the Indian company headquartered in California.
The Taiwan Semiconductor Manufacturing Company’s DCA program is centered on providing chip-implementation services and system-level design solutions. It encompasses all critical integrated circuit fabrication areas, aimed at reducing design obstacles for customers who are adopting TSMC technology.
eInfochips is expanding its silicon engineering services through this partnership. Capitalising on TSMC’s latest technology, this collaboration will prepare eInfochips to offer a wider range of design and testing services, hopes Mangesh Kulkarni, VP and GM of eInfochips’ semiconductor practice. He sees their alliance with the TSMC DCA program as a significant step forward.
Dan Kochpatcharin, Head of TSMC’s Design Infrastructure Management Division, welcomes eInfochips to the TSMC Design Center Alliance, expressing confidence in their expertise benefiting shared customers. TSMC is focused on working with its OIP ecosystem, including eInfochips, to empower designers in achieving their goals and bringing innovations to market swiftly.
The TSMC Open Innovation Platform (OIP) is a framework that encourages innovation by facilitating collaboration and sharing among designers and partners. Key to OIP is TSMC’s accuracy initiative to ensure quality across the ecosystem. The model aims to accelerate design processes, time-to-market, and revenue generation through certification programs, a vast IP portfolio, and strategic partnerships in the design ecosystem.
eInfochips has over 25 years of experience in Engineering, Research, and Development (ER&D) in the semiconductor sector. They have played a role in advancing next-gen System-on-Chips (SoCs) across various process technologies from 180nm to 3nm. They help their clients reduce time to market by leveraging their knowledge in various fields such as IoT, AI/ML, security, sensors, silicon, wireless, cloud, and power. The company has gained recognition as a player in engineering R&D services from multiple reputable analysts and industry organisations, including Gartner, Zinnov, ISG, IDC, and NASSCOM.
