ISIG plans to bring semiconductor companies, investors and government officials together to strengthen India’s advanced packaging and power electronics capabilities and move industry plans towards execution.
The International Semiconductor Industry Group (ISIG) plans to organise a two-day, closed-door executive summit to bring together semiconductor executives, investors and government officials to strengthen India’s advanced chip packaging and power electronics capabilities.
The initiative will focus on advanced packaging and power electronics, two segments that ISIG believes will drive the next phase of semiconductor industry growth. Announcing the plan at a media roundtable, Salah Nasri, Co-founder and Chief Executive Officer, ISIG, said advanced packaging had gained importance following the Covid-19 pandemic and subsequent advancements in artificial intelligence (AI). In 2015, most companies viewed semiconductor packaging as a back-end commodity product.
Nasri believes India could become an important geography for advanced packaging, alongside established players such as the US, Taiwan, Japan, South Korea and China.
“Based on the due diligence that we have done throughout the (advanced packaging) ecosystem, I feel that India has a very strong stance in this. Countries like the US, Taiwan, Japan, Korea, and China have domination in this area. India is going to the next geography,” he said.
ISIG also aims to bridge the gap between planning and execution for advanced packaging and power electronics semiconductor units in India, said Santosh Kumar, President of the India Chapter, ISIG, and CEO of Paras Semiconductors.
“India has a significant opportunity to strengthen its position in the global semiconductor ecosystem, particularly in advanced packaging, OSAT and power electronics. The focus must now be on building domestic capabilities, strengthening supply chains and enabling Indian companies to move towards higher value addition,” Kumar said.
