Built on TSMC’s cutting-edge node, the processor delivers native agentic AI capabilities alongside major compute and efficiency gains.
Taiwanese chip designer MediaTek has launched its latest flagship System-on-Chip (SoC), the Dimensity 9600 Pro. Manufactured using TSMC’s advanced 2-nanometre (2nm) process node, the new silicon integrates native agentic artificial intelligence (AI) capabilities alongside substantial improvements to compute performance and energy efficiency.
The processor introduces a dual-NPU setup and a dedicated Agentic AI Engine capable of running on-device models with up to 30 billion parameters, whilst reducing always-on AI energy consumption by 40 per cent. MediaTek Corporate Senior Vice President JC Hsu emphasised that the Native AI architecture is specifically engineered to meet rising consumer demand for scalable, highly intelligent smartphone experiences.
At the heart of the chipset is an ‘All Big Core’ CPU layout featuring two C2-Ultra cores running at up to 4.55GHz, three C2-Pro cores at 4.35GHz, and three C2-Pro cores at 3.1GHz. Compared with its predecessor, single-core performance increases by up to 17 per cent and multi-core performance by 15 per cent, whilst multi-core power consumption drops by a significant 61 per cent.
Graphics and memory capabilities have also received substantial upgrades. Supported by a 34.5MB cache alongside LPDDR6 and UFS 5.0 compatibility, the integrated G2-Ultra NX GPU yields a 27 per cent gain in peak performance, 18 per cent faster raytracing, and up to 185fps mobile gaming output.
Advanced camera capabilities are driven by the Imagiq 1290 Image Signal Processor (ISP) and an AI Imaging Fusion Architecture, enabling NPU-powered 60fps motion capture and native 4K ultra-slow-motion video recording at 240fps. Alongside the flagship model, MediaTek introduced the Dimensity 9600M, designed to bring agentic AI features, HyperEngine gaming enhancements, and ISP capabilities to a broader tier of devices. The first commercial smartphones powered by both chipsets are slated to ship later this quarter.
