Five-year agreement expands Malta, New York fab to create domestic supply chain for high-performance AI chips.
GlobalFoundries (GF) has reached an agreement with TSMC to supply silicon interposers for TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging ecosystem from a US manufacturing base.
Under the initial five-year contract, GF will act as a foundry partner to TSMC, adding interposer manufacturing capacity at its principal fabrication facility in Malta, New York. The partnership establishes the first domestic US supply source for silicon interposers—a critical component in advanced 2.5D and 3D packaging that integrates embedded deep trench capacitors to enhance thermal and power efficiency in high-performance computing and AI accelerators.
Highlighting the supply chain impact, Ed Kaste, Senior Vice President of the CMOS Business Unit at GlobalFoundries, stated: “Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems. By providing manufacturing service using GF’s trusted U.S. manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain.”
Volume production and capacity ramp-up at the New York site are scheduled to begin during the first half of 2028. The framework also includes provisions to scale manufacturing volumes further as hyperscale demand for advanced chiplet packaging grows over subsequent product generations.
