Industry's Buzz
MIPS and Xcelsa Labs Partner to Accelerate Custom Silicon Development
Strategic collaboration integrates verified intelligence platforms to cut design iteration cycles for AI, automotive, and robotics hardware.
MIPS, a subsidiary of GlobalFoundries, has announced a...
Global Electronics Association and Fraunhofer Partner on EU Chips Act Pilot Line
Strategic collaboration aims to standardise advanced packaging and chiplet integration to bridge the gap between pilot-line innovation and mass production.
The Global Electronics Association has...
TOPPAN Opens First Overseas FC-BGA Substrate Plant in Singapore
FC-BGA substrates are used in high-density semiconductor packages
TOPPAN Inc. has established its first overseas production facility for Flip Chip Ball Grid Array (FC-BGA) substrates...
Canon India eyes semiconductor equipment opportunity as chip manufacturing expands
Canon is also expanding its presence in surveillance and security, medical diagnostic imaging, and industrial printing.
Canon India is looking to tap the country’s emerging...
China’s CXMT Favours Domestic Equipment in $5.2bn DRAM Expansion Drive
Mainland memory giant targets aggressive local sourcing as it accelerates advanced chip production and in-house testing.
China’s leading dynamic random-access memory (DRAM) producer, ChangXin Memory...
Learn From Leaders
Does India’s Chip Packaging Growth Need Local Materials At Scale?
What will it take for specialised semiconductor materials manufacturing to grow in India? Packaging volumes will be a key factor as OSAT facilities move...
“Our goal is to build data centres in space.” – Ronak Kumar Samantray, TM2Space
A space startup aims to build orbital data centres, letting users run AI models and store data on satellites while also supplying satellite hardware...
India’s Photonics Puzzle Is Finally Coming Together
Can India turn its scattered photonics capabilities into a stronger industry? A new association aims to connect the ecosystem and strengthen the domestic value...
Mini-Circuits CEO Jin Bains on Navigating High-Frequency Component SWaP-C Constraints, Emerging Markets, and Career...
In this exclusive, Jin Bains, Chief Executive Officer (CEO) of Mini-Circuits, explains in a conversation with Dilin Anand of EFY about areas of emerging...
India Needs Not a Hundred, But Thousands of Chip Diversified Companies
Can India build a semiconductor ecosystem beyond fabs? Indiesemic believes thousands of diversified chip companies are needed to make that possible.
India’s semiconductor push is...
Startups
“The cloud isn’t the only way to run AI. We’re proving it can happen...
A startup is building a decentralised AI and communication network that runs across everyday devices instead of centralised cloud servers. In an interview, Jash...
Building AI Chips, One Block at a Time
What if building an AI chip became as simple as assembling reusable blocks? The startup is working to make custom silicon accessible beyond the...
“We Let Designers Focus on Innovation, Not Infrastructure.”- Seema Johar, Compcarta Solutions
In an exclusive interview, Seema Johar of Compcarta speaks with EFY’s Akanksha Sondhi Gaur about why setting up an EDA environment can be harder...
Space Solar Secures $1.7m ARIA Contract for Wireless Power Beaming
Harwell-based firm to develop ground-to-air RF beaming technology for persistent high-altitude platforms.
Harwell-based wireless power specialist Space Solar has secured a $1.7 million (£1.3 million)...
“We are democratising custom silicon with reusable chiplets, enabling more companies to build their...
In an exclusive interview,Mohit Gupta from TYLsemi explains to Saba Aafreen from Electronics For You as to why the future of AI infrastructure will...