Slitting, a process that cuts master film rolls into customer-specific widths, plays a crucial role in ensuring product quality and supply reliability
Asahi Kasei has inaugurated a new slitting facility for its SUNFORT™ dry film photoresist (DFR) at its manufacturing site in Tainan, Taiwan, to strengthen the supply of advanced semiconductor packaging materials amid rising AI-driven demand.
The facility is expected to begin commercial operations in July. The company has invested approximately ¥2 billion (around $12 million) in the expansion, which will increase slitting capacity by 40% and has the potential to double current output in the future.
Asahi Kasei has been carrying out SUNFORT™ DFR slitting at its Tainan site since 1997. The new facility is designed to support the growing demand for advanced semiconductor packaging, driven by the rapid adoption of AI technologies and the increasing need for high-performance chips.
Slitting, a process that cuts master film rolls into customer-specific widths, plays a crucial role in ensuring product quality and supply reliability. The new facility features advanced slitting equipment and high-standard cleanroom environments to improve productivity while maintaining stringent quality requirements.
Taiwan remains a key manufacturing hub for semiconductor packaging, making local production and supply increasingly important for serving customers with shorter lead times and reliable deliveries.
SUNFORT™ DFR is used in semiconductor back-end manufacturing to transfer fine circuit patterns onto packaging substrates using conventional stepper exposure and laser direct imaging (LDI) systems. The material is designed to deliver high-resolution patterning required for advanced packaging applications.
The investment supports Asahi Kasei’s strategy of expanding its electronics business. In May 2025, the company introduced SUNFORT™ TA, a new DFR series developed for advanced semiconductor packaging used in AI server applications.
