The investment is part of Micron’s broader global manufacturing expansion to meet growing demand for AI, high-performance computing, and data centre applications
Micron Technology has broken ground on a $9.3 billion expansion of its semiconductor manufacturing facility in Hiroshima Prefecture, Japan, to increase production of advanced memory chips, including next-generation high-bandwidth memory (HBM) used in artificial intelligence processors.
The expanded facility is expected to begin commercial shipments around the summer of 2028. Japan’s Ministry of Economy, Trade and Industry (METI) will support the project with subsidies of up to $3.1 billion as part of the country’s efforts to strengthen its semiconductor industry.
The investment is part of Micron’s broader global manufacturing expansion to meet growing demand for AI, high-performance computing, and data centre applications. Alongside its Japan project, the company is building two advanced fabrication plants in Boise, Idaho, and is developing a $100 billion semiconductor manufacturing campus near Syracuse, New York, to expand domestic DRAM production.
Micron’s expansion comes amid an industry-wide race to increase memory chip capacity, with rivals SK Hynix and Samsung Electronics also investing heavily in new manufacturing facilities to meet surging AI-driven demand.
