As electronics become smaller and denser, stencil technology is driving yield and reliability. Sakthivel P of MST Manufacturing Technologies Pvt Ltd tells EFY’s Akanksha Sondhi Gaur how nano-coatings, precision cutting, and advanced materials are redefining solder paste printing.
Q. To begin with, what is Maxim SMT currently focused on in the electronics manufacturing ecosystem?
A. Our core focus is on the manufacturing side of electronics, particularly surface-mount technology (SMT) processes. While the broader ecosystem includes electronics manufacturing services (EMS) equipment like ASMPT pick-and-place machines, screen printers, and reflow systems, our strength lies in stencil manufacturing and process optimisation. We specialise in delivering high-precision stencil solutions that directly impact the quality of solder paste printing. Over the years, we have developed strong expertise in advanced stencil manufacturing, integrating cutting-edge technologies such as nanocoatings to enhance productivity, consistency, and reliability in printed circuit board (PCB) assembly.
Q. What makes your stencil technology unique, and how does it support high-density PCB manufacturing?
A. Our stencil technology combines precision engineering with chemical vapour deposition (CVD)-based nano-coating. This ultra-thin (100-200nm) coating covers both the surface and inner aperture walls, ensuring uniform solder paste release, higher transfer efficiency, and fewer defects. It enhances reliability, supports fine-pitch, high-density PCBs, and delivers durability of up to 100,000 printing strokes. Widely adopted in mass production, it is also future-ready for applications like wafer-level stencils.
Q. Beyond stencils, what other solutions do you provide to the industry?
A. We go beyond stencil manufacturing by offering jigs and fixtures for PCB assembly. This includes reflow pallets for mobile phone applications and server boards. More importantly, we take a solution-driven approach. We evaluate customer challenges and provide optimised solutions that improve process efficiency, reduce defects, and enhance throughput. This has helped us position ourselves not just as a supplier, but as a process partner.
Q. Can you walk us through the machinery and infrastructure behind your operations?
A. We utilise high-precision laser cutting machines sourced from China, capable of achieving positioning accuracy of up to 2 microns and repeatability of around 5 microns. This level of precision is essential for handling modern PCB designs with extremely fine component footprints. In addition, we deploy CVD-based nano-coating machines, which are critical for applying uniform coatings across stencil surfaces and aperture walls. These machines are primarily used in high-volume manufacturing environments, especially in mobile phone production, where precision and consistency are critical.
Q. These machines involve a significant investment. What drove your decision to adopt them?
A. The investment per machine is typically $80,000-$90,000, which is relatively high. However, our focus has always been on long-term value rather than upfront cost. These technologies enable trouble-free manufacturing and significantly reduce process-related issues. They improve transfer efficiency, minimise defects, and enhance overall process stability. Compared to conventional solutions, they offer superior performance, making them a worthwhile investment.
Q. What does your manufacturing capacity and infrastructure look like?
A. We combine scale with precision. Our setup includes 18 laser-cutting machines in Chennai, with four more coming up in Bengaluru, and around six CVD nano-coating machines, making us one of India’s largest manufacturers of nano-coated stencils. Our systems achieve approximately 2-micron accuracy and approximately 5-micron repeatability, critical for high-density PCBs. Beyond stencils, we also support jig and fixture fabrication, including reflow pallets for mobile and server applications.
Q. What key industry challenges led you to adopt such advanced technologies?
A. One of the biggest challenges is not just machinery but raw materials. High-precision stencil manufacturing requires ultra-fine grain stainless steel foils, which are not readily available domestically and must be imported from Japan. With the increasing density of PCB designs, especially in smartphones, apertures can be as small as 0.1mm. Achieving clean cuts and consistent performance at this scale requires both advanced machinery and high-quality materials. Our investments are aimed at addressing these challenges holistically, combining the right machines, materials, and expertise.
Q. You mentioned wafer-level capabilities. Can you elaborate on this area?
A. This is one of the most exciting and challenging areas we are working on. Wafer-level stencils can contain up to 500,000 apertures per sheet, requiring extremely high precision and consistency. Our combination of advanced laser cutting and nano-coating enables us to meet these complex requirements. This capability positions us for future opportunities as electronics manufacturing increasingly converges with semiconductor-level processes. We are preparing for a future where SMT meets semiconductor-level precision.
Q. Do you see this level of precision becoming the industry norm?
A. Yes, absolutely. Precision is no longer optional; The race now is beyond 0.1mm in solder paste printing. The trend towards miniaturisation and higher density is only accelerating. As component sizes shrink, the demand for ultra-precise manufacturing processes will continue to grow. We believe our approach sets a benchmark for the industry, and we expect more players to adopt similar technologies in the coming years.
Q. How do you differentiate yourself from competitors, especially in the nano-coating space?
A. While several companies are entering the nano-coating space, effectively applying it in stencil manufacturing remains highly complex. It requires deep expertise in materials, process control, and application techniques. Our ability to combine all these elements along with our large-scale infrastructure gives us a strong competitive edge. We are not just adopting technology; we are mastering its application in a critical manufacturing context.
Q. How do your solutions impact manufacturers in terms of yield and efficiency?
A. Our solutions directly improve first-pass yield by ensuring consistent solder paste deposition. This reduces rework, minimises defects, and improves overall production efficiency. In high-volume manufacturing, even small improvements in transfer efficiency can lead to significant cost savings. Our technology helps manufacturers achieve better reliability and scalability in their operations.
Q. Are you exploring AI or Industry 4.0 integration in your processes?
A. Yes, we see strong potential in integrating artificial intelligence (AI) and data-driven approaches. Software-based data analysis can help reduce process issues, optimise parameters, and improve overall efficiency. AI can also support design for manufacturing (DFM) by analysing component libraries and predicting potential challenges in advance. This will play a key role in the next phase of manufacturing evolution.
Q. With a limited number of players in this space in India, how do you see your role evolving?
A. We see ourselves as early movers in large-scale nano-coated stencil manufacturing in India. Our focus is on continuous upgrading in both technology and process capability. As the industry evolves, we aim to lead from the front by setting benchmarks and driving innovation in this domain.
Q. What sets Maxim SMT apart?
A. Our strength lies in combining advanced materials, precision manufacturing, and more than 30 years of process expertise. We use ultra-fine grain stainless steel foils from Japan to achieve clean cuts at sub-0.1 mm apertures and handle ultra-high-density designs, including wafer-level stencils with up to 500,000 apertures, delivering semiconductor-level precision.
Q. What is next in innovation?
A. We are advancing wafer-level stencil manufacturing, AI-driven DFM, and data-led process optimisation, alongside investing in new materials, coatings, and expansion, including Bengaluru. Our focus is on blending precision, materials, and intelligence to meet future manufacturing demands.
***Box item 1 started***
Organisation: MST Manufacturing Technologies Pvt Ltd
Parent company: Maxim SMT Technologies Pvt Ltd
Headquarters: Manesar, Gurugram, Haryana, India
Established: 2008 (Maxim SMT Technologies Pvt Ltd)
GM: Sakthivel Padmanapan
***Box item 1 ended***
