TSMC is building a dedicated advanced packaging verification facility in Taiwan to help semiconductor suppliers validate technologies faster and accelerate their path to commercial production.
TSMC is expanding its semiconductor operations in southern Taiwan with a new advanced packaging verification facility at Kaohsiung’s Baipu Industrial Park, aimed at accelerating the qualification of packaging technologies and supplier equipment before commercial production.
The facility will bring chipmakers, equipment suppliers, and materials providers together in a production-like environment to test and validate technologies. TSMC Vice President of Advanced Packaging He Jun said the site will initially cover around three hectares and comprise two buildings.
“The Baipu site will initially occupy around three hectares and comprise two buildings. The facility will feature a modular process verification line designed to help suppliers complete hardware, software and process integration testing before technologies are introduced into commercial manufacturing operations.”
The modular verification line will support hardware, software, and process integration testing. Equipment suppliers can validate installation, compatibility, and integration requirements, while materials companies can assess performance under production-like conditions. Process engineers can identify manufacturing issues earlier, potentially reducing development risks and shortening the path to commercial deployment.
The move highlights the growing importance of advanced packaging, chiplets, and heterogeneous integration as semiconductor demand rises across AI, data centres, automotive electronics, and connected devices. It also reflects a shift in semiconductor competition from wafer-fabrication capacity towards faster technology validation and production readiness.
The project is expected to strengthen southern Taiwan’s semiconductor ecosystem and complement clusters in Nanzih, Renwu, and Ciaotou, potentially attracting further investment by bringing suppliers and manufacturers closer together.
