Delivering a milestone, Kaynes Semicon launches India’s first commercially manufactured multi-chip module for advanced power applications.
Kaynes Semicon has delivered India’s first commercially manufactured multi-chip module (MCM) from its Sanand OSAT facility to California-based Alpha & Omega Semiconductor (AOS), marking a landmark step in the country’s semiconductor journey. The first shipment, completed early Wednesday, included around 900 intelligent power modules (IPMs), used in high-power applications such as electric vehicles and renewable energy systems.
The Sanand facility was established under the India Semiconductor Mission (ISM 1.0) with ₹16.535 billion in central support. Pilot production began in April 2025, with the plant now capable of producing 3,000 IPMs per day. Mass production is expected to ramp up to 1.5 million chips per day by the first quarter of FY2026-27, eventually reaching a full capacity of 6.3 million chips per day. Kaynes is set to deliver 10 million chips annually to AOS over the next five years.
Each IPM integrates 17 semiconductor dies including six IGBTs, two controller ICs, six fast recovery diodes, and three additional diodes into a single compact package. Unlike traditional single-die packages, the multi-chip module enables higher performance, flexibility, and efficiency by combining power switching, control, and protection circuits in one unit.
Raghu Panicker, CEO of Kaynes Semicon, highlighted that this achievement positions India alongside global players in high-integration semiconductor modules, noting the company’s readiness to compete with leaders like Infineon. Analyst Neil Shah emphasized that the move represents a significant leap in packaging complexity and global collaboration potential.
The total investment in the OSAT facility stands at ₹33.07 billion, contributed by the Centre, the Gujarat government, and Kaynes itself. Kaynes Semicon’s milestone not only advances India’s semiconductor capabilities but also strengthens its position in the global chip ecosystem.
